The content of the zip file "Archive (Figure data)" including EDS, XRD, SEM, low-temperature resistance, resistivity measurements on a-SiC:Cu films and capcitance and current density-voltage measurements on Cu/a-SiC:Cu/Au microcapacitors. All the results have been presented in an article "Microstructure and electrical properties of co-sputtered Cu
embedded amorphous SiC", accepted by Materials Letters.

JSM 6500 Field Emission Gun-Scanning Electron Microscope, Rigaku Smartlab X-ray Diffractometer, Nanometrics HL5500PC Hall Effect Measurement System, Agilent 4279A C-V Meter, Agilent B1500A Semiconductor Device Analyzer, etc. were used.