Fabrication of high-resolution strain sensors based on wafer-level vacuum packaged MEMS resonators
Fabrication of high-resolution strain sensors based on wafer-level vacuum packaged MEMS resonators
The paper reports on the fabrication and characterization of high-resolution strain sensors for structural materials based on Silicon On Insulator flexural resonators manufactured by polysilicon Low-Pressure Chemical Vapour Deposition vacuum packaging. The sensors present sensitivity of 164 Hz/μ.epsilon and strain resolution limit of 150 p.epsilon on steel for a measurement time of 315 ms, in both tensile and compressive strain regimes. The readout of the sensor is implemented with a transimpedance oscillator circuit implemented on Printed Circuit Board, in which a microcontroller-based reciprocal frequency counter is integrated. The performance of the sensors on steel are investigated for measurement bandwidths from 1.5 to 500 Hz and a comparison with conventional metal strain gauges is proposed.
90-101
Belsito, Luca
7493888b-85dd-4dea-9393-ff96454a861a
Ferr, Matteo
627b812c-d393-4618-af6c-253d90f73b24
Mancarella, Fulvio
853a983e-aaec-45fc-8a63-ee05d3fc28c8
Masini, Luca
ba878d91-07db-4340-986a-3d70aa60e3af
Yan, Jize
786dc090-843b-435d-adbe-1d35e8fc5828
Seshia, Ashwin A.
6fe2b5b5-e451-41e2-a23a-601c9faf7d8a
Soga, Kenichi
e43028e3-af4d-4ea4-a747-6cc6dacc849b
Roncaglia, Alberto
b52a196f-c2f1-4b41-9dec-4f09f4059564
1 March 2016
Belsito, Luca
7493888b-85dd-4dea-9393-ff96454a861a
Ferr, Matteo
627b812c-d393-4618-af6c-253d90f73b24
Mancarella, Fulvio
853a983e-aaec-45fc-8a63-ee05d3fc28c8
Masini, Luca
ba878d91-07db-4340-986a-3d70aa60e3af
Yan, Jize
786dc090-843b-435d-adbe-1d35e8fc5828
Seshia, Ashwin A.
6fe2b5b5-e451-41e2-a23a-601c9faf7d8a
Soga, Kenichi
e43028e3-af4d-4ea4-a747-6cc6dacc849b
Roncaglia, Alberto
b52a196f-c2f1-4b41-9dec-4f09f4059564
Belsito, Luca, Ferr, Matteo, Mancarella, Fulvio, Masini, Luca, Yan, Jize, Seshia, Ashwin A., Soga, Kenichi and Roncaglia, Alberto
(2016)
Fabrication of high-resolution strain sensors based on wafer-level vacuum packaged MEMS resonators.
Sensors and Actuators A: Physical, 239, .
(doi:10.1016/j.sna.2016.01.006).
Abstract
The paper reports on the fabrication and characterization of high-resolution strain sensors for structural materials based on Silicon On Insulator flexural resonators manufactured by polysilicon Low-Pressure Chemical Vapour Deposition vacuum packaging. The sensors present sensitivity of 164 Hz/μ.epsilon and strain resolution limit of 150 p.epsilon on steel for a measurement time of 315 ms, in both tensile and compressive strain regimes. The readout of the sensor is implemented with a transimpedance oscillator circuit implemented on Printed Circuit Board, in which a microcontroller-based reciprocal frequency counter is integrated. The performance of the sensors on steel are investigated for measurement bandwidths from 1.5 to 500 Hz and a comparison with conventional metal strain gauges is proposed.
Text
[71] Fabrication of High-Resolution Strain Sensors Based on Wafer-Level Vacuum Packaged MEMS Resonators.pdf
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Accepted/In Press date: 7 January 2016
e-pub ahead of print date: 12 January 2016
Published date: 1 March 2016
Organisations:
Nanoelectronics and Nanotechnology
Identifiers
Local EPrints ID: 393244
URI: http://eprints.soton.ac.uk/id/eprint/393244
ISSN: 0924-4247
PURE UUID: 21b65968-9663-4bd8-8a60-cc626f4a9730
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Date deposited: 25 Apr 2016 09:24
Last modified: 15 Mar 2024 03:53
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Contributors
Author:
Luca Belsito
Author:
Matteo Ferr
Author:
Fulvio Mancarella
Author:
Luca Masini
Author:
Ashwin A. Seshia
Author:
Kenichi Soga
Author:
Alberto Roncaglia
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