Thermal optimization in network-on-chip-based 3D chip multiprocessors using dynamic programming networks

Dahir, Nizar, Al-Dujaily, Ra'ed, Mak, Terrence and Yakovlev, Alex (2014) Thermal optimization in network-on-chip-based 3D chip multiprocessors using dynamic programming networks. [in special issue: Real-Time and Embedded Technology and Applications, Domain-Specific Multicore Computing, Cross-Layer Dependable Embedded Systems, and Application of Concurrency to System Design (ACSD'13)] ACM Transactions on Embedded Computing Systems, 13 (4s), 139/1-139/25, [139]. (doi:10.1145/2584668).

Record type: Article

Abstract

The substantial silicon density in 3D VLSI, albeit its numerous advantages, introduces serious thermal threats that would lead to faults and system failures. This article introduces a new strategy to effectively diffuse heat from NoC-based 3D CMPs. Runtime Dynamic Programming Network (DPN) is proposed to optimize routing directions and provide silicon temperature moderation. Both on-chip reliability and computational performance have been improved by 63% and 27%, respectively, with the DPN approach. This work enables a new avenue to explore the adaptability for future large-scale 3D integration.

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