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Thermal optimization in network-on-chip-based 3D chip multiprocessors using dynamic programming networks

Thermal optimization in network-on-chip-based 3D chip multiprocessors using dynamic programming networks
Thermal optimization in network-on-chip-based 3D chip multiprocessors using dynamic programming networks
The substantial silicon density in 3D VLSI, albeit its numerous advantages, introduces serious thermal threats that would lead to faults and system failures. This article introduces a new strategy to effectively diffuse heat from NoC-based 3D CMPs. Runtime Dynamic Programming Network (DPN) is proposed to optimize routing directions and provide silicon temperature moderation. Both on-chip reliability and computational performance have been improved by 63% and 27%, respectively, with the DPN approach. This work enables a new avenue to explore the adaptability for future large-scale 3D integration.
139/1-139/25
Dahir, Nizar
0874e096-12cf-40be-b9eb-2394fca1ebd7
Al-Dujaily, Ra'ed
e7bc6504-5109-478b-a56c-859142c9f77a
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53
Yakovlev, Alex
d6c94911-c126-4cb7-8f92-d71a898ebbb2
Dahir, Nizar
0874e096-12cf-40be-b9eb-2394fca1ebd7
Al-Dujaily, Ra'ed
e7bc6504-5109-478b-a56c-859142c9f77a
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53
Yakovlev, Alex
d6c94911-c126-4cb7-8f92-d71a898ebbb2

Dahir, Nizar, Al-Dujaily, Ra'ed, Mak, Terrence and Yakovlev, Alex (2014) Thermal optimization in network-on-chip-based 3D chip multiprocessors using dynamic programming networks. [in special issue: Real-Time and Embedded Technology and Applications, Domain-Specific Multicore Computing, Cross-Layer Dependable Embedded Systems, and Application of Concurrency to System Design (ACSD'13)] ACM Transactions on Embedded Computing Systems, 13 (4s), 139/1-139/25, [139]. (doi:10.1145/2584668).

Record type: Article

Abstract

The substantial silicon density in 3D VLSI, albeit its numerous advantages, introduces serious thermal threats that would lead to faults and system failures. This article introduces a new strategy to effectively diffuse heat from NoC-based 3D CMPs. Runtime Dynamic Programming Network (DPN) is proposed to optimize routing directions and provide silicon temperature moderation. Both on-chip reliability and computational performance have been improved by 63% and 27%, respectively, with the DPN approach. This work enables a new avenue to explore the adaptability for future large-scale 3D integration.

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Accepted/In Press date: 4 November 2013
e-pub ahead of print date: 1 July 2014
Published date: 1 July 2014
Organisations: Electronic & Software Systems

Identifiers

Local EPrints ID: 397439
URI: http://eprints.soton.ac.uk/id/eprint/397439
PURE UUID: 66ccc5de-b7e2-402f-8525-80530fe420fd

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Date deposited: 01 Jul 2016 10:11
Last modified: 15 Mar 2024 01:14

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Contributors

Author: Nizar Dahir
Author: Ra'ed Al-Dujaily
Author: Terrence Mak
Author: Alex Yakovlev

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