High-resolution strain sensing on steel by Silicon-On-Insulator flexural resonators fabricated with chip-level vacuum packaging
High-resolution strain sensing on steel by Silicon-On-Insulator flexural resonators fabricated with chip-level vacuum packaging
This paper reports on the fabrication and characterization of high-resolution strain sensors for steel based on Silicon On Insulator flexural resonators manufactured with chip-level LPCVD vacuum packaging. The sensors present high sensitivity (120 Hz/??), very high resolution (4 n?), low drift, and near-perfect reversibility in bending tests performed in both tensile and compressive strain regimes.
992-995
Belsito, Luca
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Ferri, Matteo
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Mancarella, Fulvio
853a983e-aaec-45fc-8a63-ee05d3fc28c8
Roncaglia, Alberto
b52a196f-c2f1-4b41-9dec-4f09f4059564
Yan, Jize
786dc090-843b-435d-adbe-1d35e8fc5828
Seshia, A. Ashwin
674d2acc-6942-432d-9f32-e0d8fffcd36e
Soga, Kenichi
e43028e3-af4d-4ea4-a747-6cc6dacc849b
Belsito, Luca
7493888b-85dd-4dea-9393-ff96454a861a
Ferri, Matteo
42a2809c-1bb6-4c74-ab6b-c07b040691e0
Mancarella, Fulvio
853a983e-aaec-45fc-8a63-ee05d3fc28c8
Roncaglia, Alberto
b52a196f-c2f1-4b41-9dec-4f09f4059564
Yan, Jize
786dc090-843b-435d-adbe-1d35e8fc5828
Seshia, A. Ashwin
674d2acc-6942-432d-9f32-e0d8fffcd36e
Soga, Kenichi
e43028e3-af4d-4ea4-a747-6cc6dacc849b
Belsito, Luca, Ferri, Matteo, Mancarella, Fulvio, Roncaglia, Alberto, Yan, Jize, Seshia, A. Ashwin and Soga, Kenichi
(2013)
High-resolution strain sensing on steel by Silicon-On-Insulator flexural resonators fabricated with chip-level vacuum packaging.
Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Transducers (Transducers & Eurosensors XXVII), Barcelona, Spain.
16 - 20 Jun 2013.
.
(doi:10.1109/Transducers.2013.6626936).
Record type:
Conference or Workshop Item
(Paper)
Abstract
This paper reports on the fabrication and characterization of high-resolution strain sensors for steel based on Silicon On Insulator flexural resonators manufactured with chip-level LPCVD vacuum packaging. The sensors present high sensitivity (120 Hz/??), very high resolution (4 n?), low drift, and near-perfect reversibility in bending tests performed in both tensile and compressive strain regimes.
Text
[52] Transducers 2013 Luca.pdf
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e-pub ahead of print date: June 2013
Venue - Dates:
Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Transducers (Transducers & Eurosensors XXVII), Barcelona, Spain, 2013-06-16 - 2013-06-20
Organisations:
Nanoelectronics and Nanotechnology
Identifiers
Local EPrints ID: 398789
URI: http://eprints.soton.ac.uk/id/eprint/398789
PURE UUID: 680f1a6c-af36-4add-bde8-d2774203f36e
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Date deposited: 02 Aug 2016 11:50
Last modified: 15 Mar 2024 03:53
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Contributors
Author:
Luca Belsito
Author:
Matteo Ferri
Author:
Fulvio Mancarella
Author:
Alberto Roncaglia
Author:
A. Ashwin Seshia
Author:
Kenichi Soga
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