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An improved wireless communication fabric for emerging Network-on-Chip design

An improved wireless communication fabric for emerging Network-on-Chip design
An improved wireless communication fabric for emerging Network-on-Chip design
Existing wireless communication interface has free space signal radiation which drastically reduces the received signal strength and hence reduces the throughput efficiency of Hybrid Wired-Wireless Network-on-Chip (WiNoC). This paper addresses the issue of throughput degradation by replacing the wireless layer of WiNoCs with a novel Complementary Metal Oxide Semiconductor (CMOS) based waveguide communication fabric that is able compete with the reliability of traditional wired NoCs. A combination of a novel transducer and a commercially available thin metal conductor coated with a low cost Taconic Taclamplus dielectric material is presented to generate surface wave signals with high signal integrity. Our experimental results demonstrate that, the proposed communication fabric can achieve a 5 dB operational bandwidth of about 60 GHz around the center frequency (60 GHz). Compared to existing WiNoCs, the proposed communication fabric a performance improvement of 13.8% and 10.7% in terms of throughput and average packet delay, respectively. Specifically, under realistic traffic patterns, the average packet latency can be reduced by 30% when the mm-Wave is replaced by the proposed communication fabric.
1877-0509
415-420
Agyeman, M.
ba92fd3d-d998-463a-8175-c2eec657baa6
Tong, K.
71df51fb-9ee8-44e2-b38e-71a79c633dbb
Mak, T.
0f90ac88-f035-4f92-a62a-7eb92406ea53
Agyeman, M.
ba92fd3d-d998-463a-8175-c2eec657baa6
Tong, K.
71df51fb-9ee8-44e2-b38e-71a79c633dbb
Mak, T.
0f90ac88-f035-4f92-a62a-7eb92406ea53

Agyeman, M., Tong, K. and Mak, T. (2015) An improved wireless communication fabric for emerging Network-on-Chip design. [in special issue: The 10th International Conference on Future Networks and Communications (FNC 2015) / The 12th International Conference on Mobile Systems and Pervasive Computing (MobiSPC 2015) Affiliated Workshops] Procedia Computer Science, 56, 415-420. (doi:10.1016/j.procs.2015.07.229).

Record type: Article

Abstract

Existing wireless communication interface has free space signal radiation which drastically reduces the received signal strength and hence reduces the throughput efficiency of Hybrid Wired-Wireless Network-on-Chip (WiNoC). This paper addresses the issue of throughput degradation by replacing the wireless layer of WiNoCs with a novel Complementary Metal Oxide Semiconductor (CMOS) based waveguide communication fabric that is able compete with the reliability of traditional wired NoCs. A combination of a novel transducer and a commercially available thin metal conductor coated with a low cost Taconic Taclamplus dielectric material is presented to generate surface wave signals with high signal integrity. Our experimental results demonstrate that, the proposed communication fabric can achieve a 5 dB operational bandwidth of about 60 GHz around the center frequency (60 GHz). Compared to existing WiNoCs, the proposed communication fabric a performance improvement of 13.8% and 10.7% in terms of throughput and average packet delay, respectively. Specifically, under realistic traffic patterns, the average packet latency can be reduced by 30% when the mm-Wave is replaced by the proposed communication fabric.

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Published date: 31 July 2015
Organisations: Electronic & Software Systems

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Local EPrints ID: 401857
URI: http://eprints.soton.ac.uk/id/eprint/401857
ISSN: 1877-0509
PURE UUID: 7f5b1ef6-f0ea-49a1-9c12-7a07672d0c29

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Date deposited: 24 Oct 2016 13:52
Last modified: 19 Jul 2019 19:39

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