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Dielectrophoretic adhesion of 50-300 µm particles under ambient atmospheric conditions

Dielectrophoretic adhesion of 50-300 µm particles under ambient atmospheric conditions
Dielectrophoretic adhesion of 50-300 µm particles under ambient atmospheric conditions
The SPABRINK EU project required temporary adhesion of coloured solid “ink” particles to form an image. We use dielectrophoretic force to attach ink particles under the field from a voltage applied to an interdigitated electrode on the image carrying surface.

Finite element modeling results were compared in terms of an “adhesion factor” that included the density of particles as well as dielectric constant. In our experiments 50e300 mm alumina, silica sand and polymer particles were shown to adhere to a vertical plane electrode structure under laboratory ambient atmosphere.
Adhesion, Dielectrophoresis, Particles, Polymer
0304-3886
1-6
Smallwood, J.
4bf63fe3-e1c3-49b3-b787-6c66824ceccd
Praeger, M.
84575f28-4530-4f89-9355-9c5b6acc6cac
Chippendale, R.
754f4bb5-5ade-4cc8-9de2-2e6c12b6e333
Lewin, P.L.
78b4fc49-1cb3-4db9-ba90-3ae70c0f639e
Smallwood, J.
4bf63fe3-e1c3-49b3-b787-6c66824ceccd
Praeger, M.
84575f28-4530-4f89-9355-9c5b6acc6cac
Chippendale, R.
754f4bb5-5ade-4cc8-9de2-2e6c12b6e333
Lewin, P.L.
78b4fc49-1cb3-4db9-ba90-3ae70c0f639e

Smallwood, J., Praeger, M., Chippendale, R. and Lewin, P.L. (2016) Dielectrophoretic adhesion of 50-300 µm particles under ambient atmospheric conditions. Journal of Electrostatics, 82, 1-6. (doi:10.1016/j.elstat.2016.04.003).

Record type: Article

Abstract

The SPABRINK EU project required temporary adhesion of coloured solid “ink” particles to form an image. We use dielectrophoretic force to attach ink particles under the field from a voltage applied to an interdigitated electrode on the image carrying surface.

Finite element modeling results were compared in terms of an “adhesion factor” that included the density of particles as well as dielectric constant. In our experiments 50e300 mm alumina, silica sand and polymer particles were shown to adhere to a vertical plane electrode structure under laboratory ambient atmosphere.

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Accepted/In Press date: 6 April 2016
e-pub ahead of print date: 29 April 2016
Published date: 1 August 2016
Keywords: Adhesion, Dielectrophoresis, Particles, Polymer
Organisations: EEE
Learn more about Electronics & Computer Science research Learn more about Electrical Power Engineering research

Identifiers

Local EPrints ID: 405095
URI: http://eprints.soton.ac.uk/id/eprint/405095
DOI: doi:10.1016/j.elstat.2016.04.003
ISSN: 0304-3886
PURE UUID: 78b7bfef-0325-40b2-a85e-6a83adf14360
ORCID for M. Praeger: ORCID iD orcid.org/0000-0002-5814-6155
ORCID for P.L. Lewin: ORCID iD orcid.org/0000-0002-3299-2556

Catalogue record

Date deposited: 24 Jan 2017 16:45
Last modified: 03 Dec 2021 02:35

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Contributors

Author: J. Smallwood
Author: M. Praeger ORCID iD
Author: R. Chippendale
Author: P.L. Lewin ORCID iD

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