A low cost technique for adding microlasers to a silicon photonic platform

Abstract

In this paper we report the physical micromanipulation of standard InP telecommunications laser die in a liquid medium by means of optoelectronic tweezers. Optoelectronic tweezers have been shown to use much less optical power than optical tweezers, they do not require a coherent light source to function and the creation of multiple traps is straightforward. These properties make the technique a very good candidate for the massive parallel micromanipulation of optoelectronic components for assembly on a photonic platform. We discuss the positional and orientation accuracy of the optoelectronic tweezers in relation to the alignment requirements for low-loss coupling between the light sources and the other components in a photonic platform. Our experiments indicate that the accuracy is better than 2 μm and 2° for translations and rotations, respectively.

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Identifiers

ORCID for Colin Mitchell: orcid.org/0000-0001-9773-8842

ORCID for James Wilkinson: orcid.org/0000-0003-4712-1697

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