Microstructure and properties of a CoCrFeNiMn high-entropy alloy processed by equal-channel angular pressing
Microstructure and properties of a CoCrFeNiMn high-entropy alloy processed by equal-channel angular pressing
A CoCrFeNiMn high-entropy alloy (HEA) was processed by equal-channel angular pressing (ECAP) for up to four passes at 673 K and the results show that the strength increases gradually with increasing straining up to ~1 GPa with an elongation to failure of ~35% after four passes of ECAP. In this condition, the microstructure is a single-phase ultrafine-grained (UFG) CoCrFeNiMn HEA with an average grain size of ~100 nm and a high dislocation density. This UFG HEA was subjected to post-deformation annealing (PDA) at temperatures of 673-1073 K for 60 min and it is shown that the hardness increases slightly due to precipitation to 773 K and then decreases to 1073 K due to a combination of recrystallization, grain growth and a dissolution of precipitates. The formation of brittle σ-phase precipitates improves the strength significantly but with a minor decrease in ductility. Annealing at the peak temperature of 773 K produces a very high yield strength of ~1015 MPa and an ultimate strength of ~1080 MPa together with an excellent elongation to failure of ~30%. An analysis of the data shows that grain boundary strengthening is the most important strengthening mechanism in these ECAP samples both before and after PDA.
411-419
Shahmir, Hamed
9d330616-d35d-4db0-96e8-26195ae1c511
Mousavi, Tayebeh
d0cc107c-d48a-47c4-8b55-ee890856e54e
He, Junyang
cafc9d17-af90-4f09-8988-61c9ccb9b6bb
Lu, Zhaoping
33e0322f-c987-46e1-a857-6ed7b7275241
Kawaski, Megumi
a5ca3e53-e6b0-4723-8b9c-147d2b4e6841
Langdon, Terence G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86
29 September 2017
Shahmir, Hamed
9d330616-d35d-4db0-96e8-26195ae1c511
Mousavi, Tayebeh
d0cc107c-d48a-47c4-8b55-ee890856e54e
He, Junyang
cafc9d17-af90-4f09-8988-61c9ccb9b6bb
Lu, Zhaoping
33e0322f-c987-46e1-a857-6ed7b7275241
Kawaski, Megumi
a5ca3e53-e6b0-4723-8b9c-147d2b4e6841
Langdon, Terence G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86
Shahmir, Hamed, Mousavi, Tayebeh, He, Junyang, Lu, Zhaoping, Kawaski, Megumi and Langdon, Terence G.
(2017)
Microstructure and properties of a CoCrFeNiMn high-entropy alloy processed by equal-channel angular pressing.
Materials Science and Engineering: A, 705, .
(doi:10.1016/j.msea.2017.08.083).
Abstract
A CoCrFeNiMn high-entropy alloy (HEA) was processed by equal-channel angular pressing (ECAP) for up to four passes at 673 K and the results show that the strength increases gradually with increasing straining up to ~1 GPa with an elongation to failure of ~35% after four passes of ECAP. In this condition, the microstructure is a single-phase ultrafine-grained (UFG) CoCrFeNiMn HEA with an average grain size of ~100 nm and a high dislocation density. This UFG HEA was subjected to post-deformation annealing (PDA) at temperatures of 673-1073 K for 60 min and it is shown that the hardness increases slightly due to precipitation to 773 K and then decreases to 1073 K due to a combination of recrystallization, grain growth and a dissolution of precipitates. The formation of brittle σ-phase precipitates improves the strength significantly but with a minor decrease in ductility. Annealing at the peak temperature of 773 K produces a very high yield strength of ~1015 MPa and an ultimate strength of ~1080 MPa together with an excellent elongation to failure of ~30%. An analysis of the data shows that grain boundary strengthening is the most important strengthening mechanism in these ECAP samples both before and after PDA.
Text
SH8-MSEA-accepted
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Accepted/In Press date: 23 August 2017
e-pub ahead of print date: 24 August 2017
Published date: 29 September 2017
Identifiers
Local EPrints ID: 413516
URI: http://eprints.soton.ac.uk/id/eprint/413516
ISSN: 0921-5093
PURE UUID: e9aff457-8642-49bb-8f70-75aa1bbd7956
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Date deposited: 25 Aug 2017 16:31
Last modified: 16 Mar 2024 05:40
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Author:
Hamed Shahmir
Author:
Tayebeh Mousavi
Author:
Junyang He
Author:
Zhaoping Lu
Author:
Megumi Kawaski
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