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Stress analysis of flexible packaging for the integration of electronic components within woven textiles

Stress analysis of flexible packaging for the integration of electronic components within woven textiles
Stress analysis of flexible packaging for the integration of electronic components within woven textiles
This paper presents the use of Finite Element Analysis (FEA) to model a new packaging technique capable of minimizing the impact of bending or shear stresses on components integrated within the yarn of an electronic textile. FEA has been used to model four conditions: shear load, tensile load, three point bending load and a change in temperature. Three types of adhesive (Dymax 3031, Delomonopox Mk055 and Delomonopox NU355) combined with three substrate materials, PEEK, Kapton and Mylar have been analyzed. The Kapton substrate with the Dymax 3031 adhesive are identified as the preferred material combination for the packaging assembly. The simulation results indicate that the lower Young's modulus of the adhesive and substrate materials produces smaller stresses in the shear, tensile and bending models. The lower coefficient of thermal expansion (CTE) of these materials also produces lower stresses when thermally cycled.
Li, Menglong
23dd02ab-027d-46ca-a8eb-ac9b73f3916f
Tudor, John
90c9df33-7953-4d4f-9c74-0fe1d306911b
Beeby, Stephen
ba565001-2812-4300-89f1-fe5a437ecb0d
Li, Menglong
23dd02ab-027d-46ca-a8eb-ac9b73f3916f
Tudor, John
90c9df33-7953-4d4f-9c74-0fe1d306911b
Beeby, Stephen
ba565001-2812-4300-89f1-fe5a437ecb0d

Li, Menglong, Tudor, John and Beeby, Stephen (2017) Stress analysis of flexible packaging for the integration of electronic components within woven textiles. In Proceedings - Electronic Components and Technology Conference. (doi:10.1109/ECTC.2017.23).

Record type: Conference or Workshop Item (Paper)

Abstract

This paper presents the use of Finite Element Analysis (FEA) to model a new packaging technique capable of minimizing the impact of bending or shear stresses on components integrated within the yarn of an electronic textile. FEA has been used to model four conditions: shear load, tensile load, three point bending load and a change in temperature. Three types of adhesive (Dymax 3031, Delomonopox Mk055 and Delomonopox NU355) combined with three substrate materials, PEEK, Kapton and Mylar have been analyzed. The Kapton substrate with the Dymax 3031 adhesive are identified as the preferred material combination for the packaging assembly. The simulation results indicate that the lower Young's modulus of the adhesive and substrate materials produces smaller stresses in the shear, tensile and bending models. The lower coefficient of thermal expansion (CTE) of these materials also produces lower stresses when thermally cycled.

Text Stress analysis of flexible packaging for the integration of electronic components within woven textiles - Accepted Manuscript
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More information

Accepted/In Press date: 30 May 2017
e-pub ahead of print date: 3 August 2017

Identifiers

Local EPrints ID: 413874
URI: https://eprints.soton.ac.uk/id/eprint/413874
PURE UUID: b19bf197-9871-49be-b9b9-36cf7e37ba0a
ORCID for Stephen Beeby: ORCID iD orcid.org/0000-0002-0800-1759

Catalogue record

Date deposited: 08 Sep 2017 16:30
Last modified: 06 Jun 2018 13:07

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