On the effect of solvent method processing on epoxy resin systems: a molecular dynamics study
On the effect of solvent method processing on epoxy resin systems: a molecular dynamics study
The most important prerequisite for nanocomposite preparation and characterization is to achieve a satisfactory nanoscale dispersion and several mixing methods have been suggested. The solvent method is a well-known procedure, especially for intercalating layered fillers (layered silicates, graphene, boron nitride, etc.) in polymer or pre-polymer solutions. In the present work, the usage of acetone as a solvent for epoxy resin systems was investigated as it is believed to alter the molecular structure of the system even after its complete removal. The characterization was conducted in terms of electrical and thermal response, with a comparison between a reference and an acetone mixed sample. While DSC and conductivity measurements show no apparent difference between the two systems, the temperature dependent dielectric spectra revealed alterations on the secondary relaxations, which are attributed to the molecular structure of each system.
509-512
Vryonis, Orestis
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Andritsch, Thomas
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Vaughan, Alun
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Lewin, Paul
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Vryonis, Orestis
4affde05-88f2-436f-b036-dceedf31ea9c
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c
Vaughan, Alun
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Lewin, Paul
78b4fc49-1cb3-4db9-ba90-3ae70c0f639e
Vryonis, Orestis, Andritsch, Thomas, Vaughan, Alun and Lewin, Paul
(2018)
On the effect of solvent method processing on epoxy resin systems: a molecular dynamics study.
2017 IEEE Conference on Electrical Insulation and Dielectric Phenomenon, CEIDP 2017, , Texas, United States.
22 - 25 Oct 2017.
.
(doi:10.1109/CEIDP.2017.8257525).
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Conference or Workshop Item
(Paper)
Abstract
The most important prerequisite for nanocomposite preparation and characterization is to achieve a satisfactory nanoscale dispersion and several mixing methods have been suggested. The solvent method is a well-known procedure, especially for intercalating layered fillers (layered silicates, graphene, boron nitride, etc.) in polymer or pre-polymer solutions. In the present work, the usage of acetone as a solvent for epoxy resin systems was investigated as it is believed to alter the molecular structure of the system even after its complete removal. The characterization was conducted in terms of electrical and thermal response, with a comparison between a reference and an acetone mixed sample. While DSC and conductivity measurements show no apparent difference between the two systems, the temperature dependent dielectric spectra revealed alterations on the secondary relaxations, which are attributed to the molecular structure of each system.
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Accepted/In Press date: 21 October 2017
e-pub ahead of print date: 15 January 2018
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2017 IEEE Conference on Electrical Insulation and Dielectric Phenomenon, CEIDP 2017, , Texas, United States, 2017-10-22 - 2017-10-25
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Local EPrints ID: 415117
URI: http://eprints.soton.ac.uk/id/eprint/415117
PURE UUID: 9027ae05-734d-424f-a8a2-72edd3f2f855
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Date deposited: 31 Oct 2017 17:30
Last modified: 16 Mar 2024 04:23
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Author:
Orestis Vryonis
Author:
Thomas Andritsch
Author:
Alun Vaughan
Author:
Paul Lewin
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