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A high-speed design methodology for inductive coupling links in 3D-ICs

A high-speed design methodology for inductive coupling links in 3D-ICs
A high-speed design methodology for inductive coupling links in 3D-ICs

Inductive coupling links (ICLs) are gaining traction as an alternative to through silicon vias (TSVs) for 3D integration, promising high-bandwidth connectivity without the inflated fabrication costs associated with TSV-enabled processes. For power-efficient ICL design, optimisation of the utilised physical inductor geometries is essential, however typically necessitates the use of finite element analysis (FEA) in addition to manual parameter fitting, a process that can take several hours even for a single geometry. As a result, the generation of optimised inductor designs poses a significant challenge. In this paper, we address this challenge, presenting a CAD-Tool for Optimisation of Inductive coupling Links for 3D-ICs (COIL-3D1). COIL-3D uses a rapid solver based upon semi-empirical expressions to quickly and accurately characterise a given link, in conjunction with a high-speed refined optimisation flow to find optimal inductor geometries for use in ICL-based 3D-ICs. The proposed solver achieves an average accuracy within 9.1% of commercial FEA software tools, and the proposed optimisation flow reduces the search time by 26 orders of magnitude. This work unlocks new potential for power-efficient 3D integration using inductive coupling links.

3D-IC
497-502
IEEE
Fletcher, Benjamin J.
b9ee2f3f-f125-47df-a73e-e61c0404d4c9
Das, Shidhartha
c1e693af-261c-495d-8f0f-227396df0e3b
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53
Fletcher, Benjamin J.
b9ee2f3f-f125-47df-a73e-e61c0404d4c9
Das, Shidhartha
c1e693af-261c-495d-8f0f-227396df0e3b
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53

Fletcher, Benjamin J., Das, Shidhartha and Mak, Terrence (2018) A high-speed design methodology for inductive coupling links in 3D-ICs. In 2018 Design, Automation and Test in Europe Conference and Exhibition (DATE). vol. 2018-January, IEEE. pp. 497-502 . (doi:10.23919/DATE.2018.8342059).

Record type: Conference or Workshop Item (Paper)

Abstract

Inductive coupling links (ICLs) are gaining traction as an alternative to through silicon vias (TSVs) for 3D integration, promising high-bandwidth connectivity without the inflated fabrication costs associated with TSV-enabled processes. For power-efficient ICL design, optimisation of the utilised physical inductor geometries is essential, however typically necessitates the use of finite element analysis (FEA) in addition to manual parameter fitting, a process that can take several hours even for a single geometry. As a result, the generation of optimised inductor designs poses a significant challenge. In this paper, we address this challenge, presenting a CAD-Tool for Optimisation of Inductive coupling Links for 3D-ICs (COIL-3D1). COIL-3D uses a rapid solver based upon semi-empirical expressions to quickly and accurately characterise a given link, in conjunction with a high-speed refined optimisation flow to find optimal inductor geometries for use in ICL-based 3D-ICs. The proposed solver achieves an average accuracy within 9.1% of commercial FEA software tools, and the proposed optimisation flow reduces the search time by 26 orders of magnitude. This work unlocks new potential for power-efficient 3D integration using inductive coupling links.

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A High-Speed Design Methodology for Inductive Coupling Links in 3D-ICs - Accepted Manuscript
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Accepted/In Press date: 10 November 2017
Published date: 19 April 2018
Venue - Dates: 2018 Design, Automation and Test in Europe Conference and Exhibition, Germany, 2018-03-19 - 2018-03-23
Keywords: 3D-IC

Identifiers

Local EPrints ID: 417596
URI: http://eprints.soton.ac.uk/id/eprint/417596
PURE UUID: 5ee9b9c2-e31a-4074-9626-8c3b0eae4a32
ORCID for Benjamin J. Fletcher: ORCID iD orcid.org/0000-0002-4957-1934

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Date deposited: 06 Feb 2018 17:30
Last modified: 07 Oct 2020 02:14

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Contributors

Author: Benjamin J. Fletcher ORCID iD
Author: Shidhartha Das
Author: Terrence Mak

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