The University of Southampton
University of Southampton Institutional Repository

Low-power 3D integration using inductive coupling links for neurotechnology applications

Low-power 3D integration using inductive coupling links for neurotechnology applications
Low-power 3D integration using inductive coupling links for neurotechnology applications
Three dimensional system integration offers the ability to stack multiple dies, fabricated in disparate technologies, within a single IC. For this reason, it is gaining popularity for use in sensor devices which perform concurrent analogue and digital processing, as both analogue and digital dies can be coupled together. One such class of devices are closed-loop neuromodulators; neurostimulators which perform real-time digital signal processing (DSP) to deliver bespoke treatment. Due to their implantable nature, these devices are inherently governed by very strict volume constraints, power budgets, and must operate with high reliability. To address these challenges, this paper presents a low-power inductive coupling link (ICL) transceiver for 3D integration of digital CMOS and analogue BiCMOS dies for use in closed-loop neuromodulators. The use of an ICL, as opposed to through silicon vias (TSVs), ensures high reliability and fabrication yield in addition to circumventing the use of voltage level conversion between disparate dies, improving power efficiency. The proposed transceiver is experimentally evaluated using SPICE as well as nine traditional TSV baseline solutions. Results demonstrate that, whilst the achievable bandwidth of the TSV-based approaches is much higher, for the typical data rates demanded by neuromodulator applications (0.5 - 1 Gbps) the ICL design consumes on average 36.7% less power through avoiding the use of voltage level shifters.
3D-IC, Neurotechnology
Fletcher, Benjamin James
b9ee2f3f-f125-47df-a73e-e61c0404d4c9
Das, Shidhartha
c1e693af-261c-495d-8f0f-227396df0e3b
Poon, Chi-Sang
9956b00e-5e38-4a0b-b6bd-b17ea08f4dcf
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53
Fletcher, Benjamin James
b9ee2f3f-f125-47df-a73e-e61c0404d4c9
Das, Shidhartha
c1e693af-261c-495d-8f0f-227396df0e3b
Poon, Chi-Sang
9956b00e-5e38-4a0b-b6bd-b17ea08f4dcf
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53

Fletcher, Benjamin James, Das, Shidhartha, Poon, Chi-Sang and Mak, Terrence (2018) Low-power 3D integration using inductive coupling links for neurotechnology applications. Design Automation and Test in Europe, Dresden, Germany. 19 - 23 Mar 2018. 6 pp.

Record type: Conference or Workshop Item (Paper)

Abstract

Three dimensional system integration offers the ability to stack multiple dies, fabricated in disparate technologies, within a single IC. For this reason, it is gaining popularity for use in sensor devices which perform concurrent analogue and digital processing, as both analogue and digital dies can be coupled together. One such class of devices are closed-loop neuromodulators; neurostimulators which perform real-time digital signal processing (DSP) to deliver bespoke treatment. Due to their implantable nature, these devices are inherently governed by very strict volume constraints, power budgets, and must operate with high reliability. To address these challenges, this paper presents a low-power inductive coupling link (ICL) transceiver for 3D integration of digital CMOS and analogue BiCMOS dies for use in closed-loop neuromodulators. The use of an ICL, as opposed to through silicon vias (TSVs), ensures high reliability and fabrication yield in addition to circumventing the use of voltage level conversion between disparate dies, improving power efficiency. The proposed transceiver is experimentally evaluated using SPICE as well as nine traditional TSV baseline solutions. Results demonstrate that, whilst the achievable bandwidth of the TSV-based approaches is much higher, for the typical data rates demanded by neuromodulator applications (0.5 - 1 Gbps) the ICL design consumes on average 36.7% less power through avoiding the use of voltage level shifters.

Text Low-Power 3D Integration using Inductive Coupling Links for Neurotechnology Applications - Accepted Manuscript
Download (863kB)

More information

Accepted/In Press date: 10 November 2017
Published date: 19 March 2018
Venue - Dates: Design Automation and Test in Europe, Dresden, Germany, 2018-03-19 - 2018-03-23
Keywords: 3D-IC, Neurotechnology

Identifiers

Local EPrints ID: 417597
URI: https://eprints.soton.ac.uk/id/eprint/417597
PURE UUID: a4718b8e-e6b1-4900-b872-42bdb004ec48
ORCID for Benjamin James Fletcher: ORCID iD orcid.org/0000-0002-4957-1934

Catalogue record

Date deposited: 06 Feb 2018 17:30
Last modified: 06 Jun 2018 12:14

Export record

Contributors

Author: Benjamin James Fletcher ORCID iD
Author: Shidhartha Das
Author: Chi-Sang Poon
Author: Terrence Mak

University divisions

Download statistics

Downloads from ePrints over the past year. Other digital versions may also be available to download e.g. from the publisher's website.

View more statistics

Atom RSS 1.0 RSS 2.0

Contact ePrints Soton: eprints@soton.ac.uk

ePrints Soton supports OAI 2.0 with a base URL of https://eprints.soton.ac.uk/cgi/oai2

This repository has been built using EPrints software, developed at the University of Southampton, but available to everyone to use.

We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we will assume that you are happy to receive cookies on the University of Southampton website.

×