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The thickness and material optimization of flexible electronic packaging for functional electronic textile

The thickness and material optimization of flexible electronic packaging for functional electronic textile
The thickness and material optimization of flexible electronic packaging for functional electronic textile
In this paper a three dimensional model of the electronic package has been developed using Finite element analysis (FEA) technology to evaluate the shear load, tensile, bending and thermal stresses. Simulations of a flexible flip chip electronic packaging method are performed to minimize stresses on the packaged electronic device. Three under-fill adhesives (Loctite 4860, Loctite 480 and Loctite 4902) and three substrates (Kapton, Mylar and PEEK) are compared and the optimal thickness of each is found by shear load, tensile load, bending test and thermal expansion simulations. A fixed die size of 3.5 mm x 8 mm x 0.53 mm has been simulated and evaluated experimentally under shear load. The shear experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. The Kapton substrate together with the Loctite 4902 adhesive were identified as the optimum in the simulation. The simulation of under-fill adhesive and substrate thickness identified an optimum configuration of a 0.045 to 0.052 mm thick substrate layer and a 0.042 to 0.045 mm thickness of the Loctite 4902 adhesive.
IEEE
Li, Menglong
23dd02ab-027d-46ca-a8eb-ac9b73f3916f
Tudor, Michael
46eea408-2246-4aa0-8b44-86169ed601ff
Liu, Jingqi
68b025ba-d643-40bc-848d-09aaff4a492f
Komolafe, Abiodun
5e79fbab-38be-4a64-94d5-867a94690932
Torah, Russel
7147b47b-db01-4124-95dc-90d6a9842688
Beeby, Stephen
ba565001-2812-4300-89f1-fe5a437ecb0d
Li, Menglong
23dd02ab-027d-46ca-a8eb-ac9b73f3916f
Tudor, Michael
46eea408-2246-4aa0-8b44-86169ed601ff
Liu, Jingqi
68b025ba-d643-40bc-848d-09aaff4a492f
Komolafe, Abiodun
5e79fbab-38be-4a64-94d5-867a94690932
Torah, Russel
7147b47b-db01-4124-95dc-90d6a9842688
Beeby, Stephen
ba565001-2812-4300-89f1-fe5a437ecb0d

Li, Menglong, Tudor, Michael, Liu, Jingqi, Komolafe, Abiodun, Torah, Russel and Beeby, Stephen (2018) The thickness and material optimization of flexible electronic packaging for functional electronic textile. In 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP). IEEE. 6 pp. (doi:10.1109/DTIP.2018.8394186).

Record type: Conference or Workshop Item (Paper)

Abstract

In this paper a three dimensional model of the electronic package has been developed using Finite element analysis (FEA) technology to evaluate the shear load, tensile, bending and thermal stresses. Simulations of a flexible flip chip electronic packaging method are performed to minimize stresses on the packaged electronic device. Three under-fill adhesives (Loctite 4860, Loctite 480 and Loctite 4902) and three substrates (Kapton, Mylar and PEEK) are compared and the optimal thickness of each is found by shear load, tensile load, bending test and thermal expansion simulations. A fixed die size of 3.5 mm x 8 mm x 0.53 mm has been simulated and evaluated experimentally under shear load. The shear experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. The Kapton substrate together with the Loctite 4902 adhesive were identified as the optimum in the simulation. The simulation of under-fill adhesive and substrate thickness identified an optimum configuration of a 0.045 to 0.052 mm thick substrate layer and a 0.042 to 0.045 mm thickness of the Loctite 4902 adhesive.

Text The thickness and material optimization of flexible electronic packaging for function electronic textile - Accepted Manuscript
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More information

Accepted/In Press date: 15 March 2018
e-pub ahead of print date: 30 July 2018
Published date: 2018
Venue - Dates: Design, Test, Integration & Packaging of MEMS/MOEMS, Rome, Italy, 2018-05-22 - 2018-05-25

Identifiers

Local EPrints ID: 419362
URI: https://eprints.soton.ac.uk/id/eprint/419362
PURE UUID: 930f0538-4fe5-4ecb-ac42-16b2ea7a26f2
ORCID for Russel Torah: ORCID iD orcid.org/0000-0002-5598-2860
ORCID for Stephen Beeby: ORCID iD orcid.org/0000-0002-0800-1759

Catalogue record

Date deposited: 11 Apr 2018 16:30
Last modified: 06 Oct 2018 00:39

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