The University of Southampton
University of Southampton Institutional Repository

A study on dimensional variation in flexible printed circuits during post-lamination baking

A study on dimensional variation in flexible printed circuits during post-lamination baking
A study on dimensional variation in flexible printed circuits during post-lamination baking
The dimensional shrinkage for single-layer flexible printed circuit (FPC) panels measured after post-lamination baking has been evaluated experimentally and using a finite element model. Experiments and modelling for dot hatch flexible printed circuit panels show a linearly decreasing dimensional change with increasing copper fill percentage. Across three material suppliers, there is a strong variation in dimensional change for a given FPC design. A finite element model has been developed to simulate the shrinkage due to the volumetric contraction of the epoxy adhesive. The model fits well with the experimental data for low to medium copper fill percentages, but further work to incorporate the dimensional variation in the copper is required to improve accuracy at high copper fill percentages. The model indicates that adhesive shrinkage plays an important role in the overall dimensional change in FPCs.
IEEE
Yan, Ruey Jun
952fb441-c8c6-4402-97af-c0e3e15ea6be
Abdullah, Zalina
7558b0ac-d52f-4f47-8958-8ba0d6525493
Mok, Chee Wei
841cdf5c-9f0b-4fd0-8f95-c048ca7e7540
Rotaru, Mihai
c53c5038-2fed-4ace-8fad-9f95d4c95b7e
Pu, Suan-Hui
8b46b970-56fd-4a4e-8688-28668f648f43
Yan, Ruey Jun
952fb441-c8c6-4402-97af-c0e3e15ea6be
Abdullah, Zalina
7558b0ac-d52f-4f47-8958-8ba0d6525493
Mok, Chee Wei
841cdf5c-9f0b-4fd0-8f95-c048ca7e7540
Rotaru, Mihai
c53c5038-2fed-4ace-8fad-9f95d4c95b7e
Pu, Suan-Hui
8b46b970-56fd-4a4e-8688-28668f648f43

Yan, Ruey Jun, Abdullah, Zalina, Mok, Chee Wei, Rotaru, Mihai and Pu, Suan-Hui (2016) A study on dimensional variation in flexible printed circuits during post-lamination baking. In 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC),. IEEE.. (doi:10.1109/EPTC.2016.7861530).

Record type: Conference or Workshop Item (Paper)

Abstract

The dimensional shrinkage for single-layer flexible printed circuit (FPC) panels measured after post-lamination baking has been evaluated experimentally and using a finite element model. Experiments and modelling for dot hatch flexible printed circuit panels show a linearly decreasing dimensional change with increasing copper fill percentage. Across three material suppliers, there is a strong variation in dimensional change for a given FPC design. A finite element model has been developed to simulate the shrinkage due to the volumetric contraction of the epoxy adhesive. The model fits well with the experimental data for low to medium copper fill percentages, but further work to incorporate the dimensional variation in the copper is required to improve accuracy at high copper fill percentages. The model indicates that adhesive shrinkage plays an important role in the overall dimensional change in FPCs.

Full text not available from this repository.

More information

Published date: 2 December 2016

Identifiers

Local EPrints ID: 419459
URI: https://eprints.soton.ac.uk/id/eprint/419459
PURE UUID: e0afce51-afb6-45ee-9c6e-30143f020de6
ORCID for Suan-Hui Pu: ORCID iD orcid.org/0000-0002-3335-8880

Catalogue record

Date deposited: 12 Apr 2018 16:30
Last modified: 20 Jul 2019 00:23

Export record

Altmetrics

Download statistics

Downloads from ePrints over the past year. Other digital versions may also be available to download e.g. from the publisher's website.

View more statistics

Atom RSS 1.0 RSS 2.0

Contact ePrints Soton: eprints@soton.ac.uk

ePrints Soton supports OAI 2.0 with a base URL of https://eprints.soton.ac.uk/cgi/oai2

This repository has been built using EPrints software, developed at the University of Southampton, but available to everyone to use.

We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we will assume that you are happy to receive cookies on the University of Southampton website.

×