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Electromagnetic behaviour of flexible substrates with meshed and conductive films ground planes

Electromagnetic behaviour of flexible substrates with meshed and conductive films ground planes
Electromagnetic behaviour of flexible substrates with meshed and conductive films ground planes
In this work the electromagnetic performance at high frequency of flexible substrates with meshed and conductive film ground planes is compared with that of flexible substrates with unmeshed (solid) ground planes. Several types of specially designed structures have been studied - mesh ground, conductive film ground and solid copper ground. The conductive film used in this work is based on Tatsuta silver film which is developed especially for flex interconnects to be used in hinge applications in smart phones, and LCD drivers. The flat and bend cases of the flexible substrate are also compared and reported in this work. The comparison is done in frequency domain as well as in time domain through simulation. The structures are compared in terms of their far-field radiation as well as near-field coupling. The simulations have shown that the meshed and conductive film ground will affect the near-field coupling and the loss of the transmission structures but there is little difference in terms of radiating field.
IEEE
Rotaru, M.D.
c53c5038-2fed-4ace-8fad-9f95d4c95b7e
Pu, Suan-Hui
8b46b970-56fd-4a4e-8688-28668f648f43
Kumar, A.
978219fb-21ca-4e2e-a5dd-ec2f73af3dd7
Mok, C.W.
841cdf5c-9f0b-4fd0-8f95-c048ca7e7540
Rotaru, M.D.
c53c5038-2fed-4ace-8fad-9f95d4c95b7e
Pu, Suan-Hui
8b46b970-56fd-4a4e-8688-28668f648f43
Kumar, A.
978219fb-21ca-4e2e-a5dd-ec2f73af3dd7
Mok, C.W.
841cdf5c-9f0b-4fd0-8f95-c048ca7e7540

Rotaru, M.D., Pu, Suan-Hui, Kumar, A. and Mok, C.W. (2016) Electromagnetic behaviour of flexible substrates with meshed and conductive films ground planes. In 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference. IEEE.. (doi:10.1109/IEMT.2016.7761909).

Record type: Conference or Workshop Item (Paper)

Abstract

In this work the electromagnetic performance at high frequency of flexible substrates with meshed and conductive film ground planes is compared with that of flexible substrates with unmeshed (solid) ground planes. Several types of specially designed structures have been studied - mesh ground, conductive film ground and solid copper ground. The conductive film used in this work is based on Tatsuta silver film which is developed especially for flex interconnects to be used in hinge applications in smart phones, and LCD drivers. The flat and bend cases of the flexible substrate are also compared and reported in this work. The comparison is done in frequency domain as well as in time domain through simulation. The structures are compared in terms of their far-field radiation as well as near-field coupling. The simulations have shown that the meshed and conductive film ground will affect the near-field coupling and the loss of the transmission structures but there is little difference in terms of radiating field.

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Published date: 22 September 2016

Identifiers

Local EPrints ID: 419540
URI: https://eprints.soton.ac.uk/id/eprint/419540
PURE UUID: 379fdc87-0ef0-4c15-8bfe-a9c84dc58469
ORCID for Suan-Hui Pu: ORCID iD orcid.org/0000-0002-3335-8880

Catalogue record

Date deposited: 13 Apr 2018 16:30
Last modified: 20 Jul 2019 00:23

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Contributors

Author: M.D. Rotaru
Author: Suan-Hui Pu ORCID iD
Author: A. Kumar
Author: C.W. Mok

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