Application of DIC to extract full field thermo-mechanical data from an HTS coil
Application of DIC to extract full field thermo-mechanical data from an HTS coil
A Digital Imaging Correlation (DIC) test setup was developed to accurately record the contraction of a Bi-2223 superconducting racetrack coil conduction cooled to 154 K. The coil was gripped at both ends to simultaneously measure the load and displacement induced by its own contraction. Post-processing of the DIC data derived the displacement and strain fields from two areas of interest. The global deformation of the coil structure was influ-enced by how it was restrained, but the stress-strain curve in the y-direction of the HTS coil was established, and its stiffness when under thermally induced strain found to closely match that of the epoxy resin. The coefficient of thermal expansion determined from the strain-temperature curve was in the same order of magnitude as dilatometer measurements performed upon a sample removed from a similar coil and the difference attributed to small variability in the temperatures across the coil and the mechanical restraint placed on the coil.
Cooling, Copper, Correlation, Heating systems, HTS coils, Strain, Strain measurement, strain measurement, stress, Temperature measurement
Pelegrin, Jorge
3a110c1a-ad88-4f90-bffc-7a0b5042f240
Bailey, Wendell
c356b2e3-a783-4b4c-8c7b-521696d3b37c
Crump, Duncan
69256bf1-74de-431a-8d95-2064ae672091
June 2018
Pelegrin, Jorge
3a110c1a-ad88-4f90-bffc-7a0b5042f240
Bailey, Wendell
c356b2e3-a783-4b4c-8c7b-521696d3b37c
Crump, Duncan
69256bf1-74de-431a-8d95-2064ae672091
Pelegrin, Jorge, Bailey, Wendell and Crump, Duncan
(2018)
Application of DIC to extract full field thermo-mechanical data from an HTS coil.
IEEE Transactions on Applied Superconductivity, 28 (4), [4604305].
(doi:10.1109/TASC.2018.2807376).
Abstract
A Digital Imaging Correlation (DIC) test setup was developed to accurately record the contraction of a Bi-2223 superconducting racetrack coil conduction cooled to 154 K. The coil was gripped at both ends to simultaneously measure the load and displacement induced by its own contraction. Post-processing of the DIC data derived the displacement and strain fields from two areas of interest. The global deformation of the coil structure was influ-enced by how it was restrained, but the stress-strain curve in the y-direction of the HTS coil was established, and its stiffness when under thermally induced strain found to closely match that of the epoxy resin. The coefficient of thermal expansion determined from the strain-temperature curve was in the same order of magnitude as dilatometer measurements performed upon a sample removed from a similar coil and the difference attributed to small variability in the temperatures across the coil and the mechanical restraint placed on the coil.
Text
EUCAS 2017 Pelegrin FINAL_VERSION
- Accepted Manuscript
Text
08294207
- Version of Record
More information
Accepted/In Press date: 16 February 2018
e-pub ahead of print date: 19 February 2018
Published date: June 2018
Keywords:
Cooling, Copper, Correlation, Heating systems, HTS coils, Strain, Strain measurement, strain measurement, stress, Temperature measurement
Identifiers
Local EPrints ID: 419593
URI: http://eprints.soton.ac.uk/id/eprint/419593
ISSN: 1051-8223
PURE UUID: 0adb7cab-7c79-4cad-a779-79e602092750
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Date deposited: 13 Apr 2018 16:31
Last modified: 15 Mar 2024 18:46
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Author:
Jorge Pelegrin
Author:
Duncan Crump
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