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Crack growth analysis in welded and non-welded T-joints based on lock-in digital image correlation and thermoelastic stress analysis

Crack growth analysis in welded and non-welded T-joints based on lock-in digital image correlation and thermoelastic stress analysis
Crack growth analysis in welded and non-welded T-joints based on lock-in digital image correlation and thermoelastic stress analysis

The method based on the digital image correlation (DIC) technique and thermoelastic stress analysis (TSA) is proposed to monitor the crack propagation process of T-joint specimens during the fatigue test. The lock-in amplifier is used to process DIC speckle pattern images while the specimen is dynamically loaded. The lock-in algorithm uses the fact that lock-in amplifier can be able to detect very small signal change within the measurement noise, which is often used in TSA. Using appropriate post-processing method, both the crack lengths and the stress intensity factors (SIF) can be evaluated in function of the number of fatigue cycles. The tests on non-welded T-joint specimens and welded T-joint specimens in two types of test rigs will be presented in the paper. All of the achieved results were validated by employing extended finite element method (XFEM) performed with ANSYS software.

Crackgrowth analysis, Digital image correlation, Extended finite element method, Stress intensity factor, Thermoelastic stress analysis
0142-1123
172-185
Chen, Daoyun
bb5b658a-9fdb-44b3-bab7-930b2b904aa2
Sun, Shouguang
6d9258ec-8dca-4fb7-a2a4-a05b3d137839
Dulieu-Barton, J.M.
9e35bebb-2185-4d16-a1bc-bb8f20e06632
Li, Qiang
3c32aa3f-b1b0-4e0f-b1bb-d43f9b8d04bc
Wang, Wenjing
ec75a3ab-58ba-47a3-ad3d-2bced85091de
Chen, Daoyun
bb5b658a-9fdb-44b3-bab7-930b2b904aa2
Sun, Shouguang
6d9258ec-8dca-4fb7-a2a4-a05b3d137839
Dulieu-Barton, J.M.
9e35bebb-2185-4d16-a1bc-bb8f20e06632
Li, Qiang
3c32aa3f-b1b0-4e0f-b1bb-d43f9b8d04bc
Wang, Wenjing
ec75a3ab-58ba-47a3-ad3d-2bced85091de

Chen, Daoyun, Sun, Shouguang, Dulieu-Barton, J.M., Li, Qiang and Wang, Wenjing (2018) Crack growth analysis in welded and non-welded T-joints based on lock-in digital image correlation and thermoelastic stress analysis. International Journal of Fatigue, 110, 172-185. (doi:10.1016/j.ijfatigue.2018.01.020).

Record type: Article

Abstract

The method based on the digital image correlation (DIC) technique and thermoelastic stress analysis (TSA) is proposed to monitor the crack propagation process of T-joint specimens during the fatigue test. The lock-in amplifier is used to process DIC speckle pattern images while the specimen is dynamically loaded. The lock-in algorithm uses the fact that lock-in amplifier can be able to detect very small signal change within the measurement noise, which is often used in TSA. Using appropriate post-processing method, both the crack lengths and the stress intensity factors (SIF) can be evaluated in function of the number of fatigue cycles. The tests on non-welded T-joint specimens and welded T-joint specimens in two types of test rigs will be presented in the paper. All of the achieved results were validated by employing extended finite element method (XFEM) performed with ANSYS software.

Full text not available from this repository.

More information

Accepted/In Press date: 22 January 2018
e-pub ahead of print date: 23 February 2018
Published date: 1 May 2018
Keywords: Crackgrowth analysis, Digital image correlation, Extended finite element method, Stress intensity factor, Thermoelastic stress analysis

Identifiers

Local EPrints ID: 421223
URI: http://eprints.soton.ac.uk/id/eprint/421223
ISSN: 0142-1123
PURE UUID: 8572ba28-d8c5-431b-b191-ea14d3db4bec

Catalogue record

Date deposited: 24 May 2018 16:31
Last modified: 07 Oct 2020 00:19

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