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Defect-free TiC/Si multi-layer electrical discharge coatings

Defect-free TiC/Si multi-layer electrical discharge coatings
Defect-free TiC/Si multi-layer electrical discharge coatings
The process of electrical discharge coating (EDC) may be used to deposit hard materials on conformal substrate surfaces. Next generation EDM'd components may exploit attachment phenomena to enhance recast layer properties, to avoid the need for recast layer removal. Here, a ceramic based composite layer was developed without cracking and porosity for the first time, using sequential coating using sacrificial TiC and Si electrodes. Attenuation of the discharge process by gap widening using Si debris in the gap explained improved layer properties. Composite coatings combining WC and TiC were also demonstrated, with good elemental intermixing. Attachment level was correlated strongly with melting point, with high melting point materials resisting ejection due to more rapid solidification. Nanoindentation showed the TiC and WC/TiC layers possessed the highest mean hardness values, approximately double that of the Cu based machined layer which itself yielded a much higher hardness of 11.0 GPa compared to 1.9 GPa of the substrate.
0264-1275
352-365
Murray, J.W.
3985aa41-1e0e-4504-ab90-e31a00c33c38
Cook, R.
06f8322d-81be-4f82-9326-19e55541c78f
Senin, N.
a38bc714-a333-493d-a09f-3b3037f856a1
Algodi, S.J.
4e4ada93-2360-43ff-9862-e9e76f4d5cb1
Clare, A.
bb20eb07-54cc-4758-8404-fb8e177317b8
Murray, J.W.
3985aa41-1e0e-4504-ab90-e31a00c33c38
Cook, R.
06f8322d-81be-4f82-9326-19e55541c78f
Senin, N.
a38bc714-a333-493d-a09f-3b3037f856a1
Algodi, S.J.
4e4ada93-2360-43ff-9862-e9e76f4d5cb1
Clare, A.
bb20eb07-54cc-4758-8404-fb8e177317b8

Murray, J.W., Cook, R., Senin, N., Algodi, S.J. and Clare, A. (2018) Defect-free TiC/Si multi-layer electrical discharge coatings. Materials & Design, 155, 352-365. (doi:10.1016/j.matdes.2018.06.019).

Record type: Article

Abstract

The process of electrical discharge coating (EDC) may be used to deposit hard materials on conformal substrate surfaces. Next generation EDM'd components may exploit attachment phenomena to enhance recast layer properties, to avoid the need for recast layer removal. Here, a ceramic based composite layer was developed without cracking and porosity for the first time, using sequential coating using sacrificial TiC and Si electrodes. Attenuation of the discharge process by gap widening using Si debris in the gap explained improved layer properties. Composite coatings combining WC and TiC were also demonstrated, with good elemental intermixing. Attachment level was correlated strongly with melting point, with high melting point materials resisting ejection due to more rapid solidification. Nanoindentation showed the TiC and WC/TiC layers possessed the highest mean hardness values, approximately double that of the Cu based machined layer which itself yielded a much higher hardness of 11.0 GPa compared to 1.9 GPa of the substrate.

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Defect Free TiC Si multilayer electrical discharge coatings - Accepted Manuscript
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More information

Accepted/In Press date: 10 June 2018
e-pub ahead of print date: 11 June 2018
Published date: 5 October 2018

Identifiers

Local EPrints ID: 421773
URI: http://eprints.soton.ac.uk/id/eprint/421773
ISSN: 0264-1275
PURE UUID: 1f02108d-c9ef-48d6-9f74-bd64f0779a85

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Date deposited: 27 Jun 2018 16:30
Last modified: 26 Nov 2021 05:49

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Contributors

Author: J.W. Murray
Author: R. Cook
Author: N. Senin
Author: S.J. Algodi
Author: A. Clare

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