Distributed control to improve performance of thermoelectric coolers

Harvey, Richard, Walker, Greg and Frampton, Ken (2004) Distributed control to improve performance of thermoelectric coolers. In Proceedings of 2004 ASME International Mechanical Engineering Congress. American Society Of Mechanical Engineers (ASME)..

Abstract

Thermoelectric coolers (TECs) have become potential solutions for chip cooling applications. However, the scope of TEC applicability is limited because of poor efficiency that is largely governed by material properties. This low efficiency causes increased heat production resulting in a very narrow band in which the TEC is effective. Since TECs are cooling units composed of numerous individual cooling elements, or thermocouples, the operating efficiency can be improved by implementing distributed control of the individual couples. Distributed control is a system for allowing each couple to be powered depending on the localized heat load. Distributed control would allow for increased cooling in hot spots while minimizing excess heat generated by the TEC in areas where it is not needed. The preliminary results suggest that this type of control may be feasible, and would result in a significant increase in the TEC effectiveness. The current model considers lateral heat conduction in the chip, as well as variable control of the individual thermocouples proportional to heat load. Results indicate that a 2-fold increase in COP is possible with independently controlled couples compared to a single cooler.

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