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Improving the integration of e-textile microsystems' encapsulation by modifying PDMS formulation

Improving the integration of e-textile microsystems' encapsulation by modifying PDMS formulation
Improving the integration of e-textile microsystems' encapsulation by modifying PDMS formulation

Electronic Textiles (e-textiles) enhance traditional fabrics with electronic functionality. When embedded into textiles, flexible electronic circuits need to have reliable functionality but also survive within a textile once it has been integrated. For this, electronic microsystems would be expected by consumers and manufacturers to not alter the typical characteristics the textile inherently has - such as its washability, durability, and manufacturability. Therefore, the choice of packaging substrate for microsystems in a textile must also be hydrophobic and offer minimal expansion when washed; ensuring electronics are undetectable when the textile is handled or cleaned. This paper addresses this by using polydimethylsiloxane (PDMS) as packaging encapsulation and tailoring its fabrication method specifically for textile integration. PDMS of five different base/curing agent mixing ratios were investigated - 5:1, 7:1, 10:1, 15:1, and 20:1. Contact angle measurements and swelling tests with room-temperature distilled water, tap water, detergent, and fabric conditioner solutions show PDMS as a suitable elastomeric encapsulation for electronic textile and wearable applications. Results show that a 20:1, rather than the typical 10:1, mixing ratio offers greater aqueous resistance at smaller dimensions. Having 20:1 compared to 10:1 can reduce swelling by approximately 48% - 45% in water making it more compatible with washing.

Electronic Textiles, Electronics Encapsulation, Flexible Electronics, PDMS, Washability, Wearable Technology
Institute of Electrical and Electronics Engineers Inc.
Ojuroye, Olivia
64591246-b373-4bad-83d7-8db7d7195209
Torah, Russel
7147b47b-db01-4124-95dc-90d6a9842688
Beeby, Steve
ba565001-2812-4300-89f1-fe5a437ecb0d
Ojuroye, Olivia
64591246-b373-4bad-83d7-8db7d7195209
Torah, Russel
7147b47b-db01-4124-95dc-90d6a9842688
Beeby, Steve
ba565001-2812-4300-89f1-fe5a437ecb0d

Ojuroye, Olivia, Torah, Russel and Beeby, Steve (2018) Improving the integration of e-textile microsystems' encapsulation by modifying PDMS formulation. In Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018. Institute of Electrical and Electronics Engineers Inc. 6 pp. (doi:10.1109/DTIP.2018.8394200).

Record type: Conference or Workshop Item (Paper)

Abstract

Electronic Textiles (e-textiles) enhance traditional fabrics with electronic functionality. When embedded into textiles, flexible electronic circuits need to have reliable functionality but also survive within a textile once it has been integrated. For this, electronic microsystems would be expected by consumers and manufacturers to not alter the typical characteristics the textile inherently has - such as its washability, durability, and manufacturability. Therefore, the choice of packaging substrate for microsystems in a textile must also be hydrophobic and offer minimal expansion when washed; ensuring electronics are undetectable when the textile is handled or cleaned. This paper addresses this by using polydimethylsiloxane (PDMS) as packaging encapsulation and tailoring its fabrication method specifically for textile integration. PDMS of five different base/curing agent mixing ratios were investigated - 5:1, 7:1, 10:1, 15:1, and 20:1. Contact angle measurements and swelling tests with room-temperature distilled water, tap water, detergent, and fabric conditioner solutions show PDMS as a suitable elastomeric encapsulation for electronic textile and wearable applications. Results show that a 20:1, rather than the typical 10:1, mixing ratio offers greater aqueous resistance at smaller dimensions. Having 20:1 compared to 10:1 can reduce swelling by approximately 48% - 45% in water making it more compatible with washing.

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More information

Accepted/In Press date: 5 March 2018
e-pub ahead of print date: 25 June 2018
Venue - Dates: 20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2018, Roma, Italy, 2018-05-22 - 2018-05-25
Keywords: Electronic Textiles, Electronics Encapsulation, Flexible Electronics, PDMS, Washability, Wearable Technology

Identifiers

Local EPrints ID: 422890
URI: https://eprints.soton.ac.uk/id/eprint/422890
PURE UUID: c67276aa-1a8d-47bf-83a7-4bf2ecfb9df0
ORCID for Russel Torah: ORCID iD orcid.org/0000-0002-5598-2860
ORCID for Steve Beeby: ORCID iD orcid.org/0000-0002-0800-1759

Catalogue record

Date deposited: 07 Aug 2018 16:31
Last modified: 06 Oct 2018 00:39

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Contributors

Author: Olivia Ojuroye
Author: Russel Torah ORCID iD
Author: Steve Beeby ORCID iD

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