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The influence of the molecular architecture on the thermal and the dielectric properties of epoxy resin networks

The influence of the molecular architecture on the thermal and the dielectric properties of epoxy resin networks
The influence of the molecular architecture on the thermal and the dielectric properties of epoxy resin networks

Epoxy resins are used as the base insulating material in many electrical applications, including cast resin transformers, bushings and cable terminations. The performance of the resin-based insulation governs the efficiency of these applications. To understand the factors that determine the different properties of epoxy resin insulating materials, in this work, we studied the thermal and electrical properties of amine and anhydride cured epoxy resin systems. The glass transition temperature Tg, permittivity and breakdown strength of three resin systems were investigated. The results of differential scanning calorimetry indicated that the Tg of the tested system is related to the free volume in the system, which is affected by the degree of cross linking. The extent of reactions between the resin and the hardener (or the crosslinking) is ascribed to the reaction mechanisms between the active group of the hardener and the epoxide groups of the resin. Dielectric spectroscopy revealed a standard beta relaxation in the imaginary permittivity of all systems. The strength of the beta relaxation is related to the formation of hydroxyl groups and the local structure around the crosslinking which may constrain the movement of the -OH groups. This research provides insights concerning the relations between the curing mechanisms and the thermal and electrical properties; this, consequently, represents a potential mean of tailoring the overall performance of epoxy resin systems to suit particular applications.

328-331
Institute of Electrical and Electronics Engineers Inc.
Saeedi, Istebreq A.
7be9d5da-7f76-4b52-a56c-ecf15af31287
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c
Vaughan, Alun S.
6d813b66-17f9-4864-9763-25a6d659d8a3
Salter, Daniel J.
a090c1cb-cf63-49ac-a216-a4c2fda3066b
Saeedi, Istebreq A.
7be9d5da-7f76-4b52-a56c-ecf15af31287
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c
Vaughan, Alun S.
6d813b66-17f9-4864-9763-25a6d659d8a3
Salter, Daniel J.
a090c1cb-cf63-49ac-a216-a4c2fda3066b

Saeedi, Istebreq A., Andritsch, Thomas, Vaughan, Alun S. and Salter, Daniel J. (2018) The influence of the molecular architecture on the thermal and the dielectric properties of epoxy resin networks. In ICPADM 2018 - 12th International Conference on the Properties and Applications of Dielectric Materials. vol. 2018-May, Institute of Electrical and Electronics Engineers Inc. pp. 328-331 . (doi:10.1109/ICPADM.2018.8401056).

Record type: Conference or Workshop Item (Paper)

Abstract

Epoxy resins are used as the base insulating material in many electrical applications, including cast resin transformers, bushings and cable terminations. The performance of the resin-based insulation governs the efficiency of these applications. To understand the factors that determine the different properties of epoxy resin insulating materials, in this work, we studied the thermal and electrical properties of amine and anhydride cured epoxy resin systems. The glass transition temperature Tg, permittivity and breakdown strength of three resin systems were investigated. The results of differential scanning calorimetry indicated that the Tg of the tested system is related to the free volume in the system, which is affected by the degree of cross linking. The extent of reactions between the resin and the hardener (or the crosslinking) is ascribed to the reaction mechanisms between the active group of the hardener and the epoxide groups of the resin. Dielectric spectroscopy revealed a standard beta relaxation in the imaginary permittivity of all systems. The strength of the beta relaxation is related to the formation of hydroxyl groups and the local structure around the crosslinking which may constrain the movement of the -OH groups. This research provides insights concerning the relations between the curing mechanisms and the thermal and electrical properties; this, consequently, represents a potential mean of tailoring the overall performance of epoxy resin systems to suit particular applications.

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The Influence Of The Molecular Architecture On The Thermal And The Dielectric Properties Of Epoxy Resin Networks - Accepted Manuscript
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Published date: 29 June 2018
Venue - Dates: 12th International Conference on the Properties and Applications of Dielectric Materials, Xi'an, China, 2018-05-20 - 2018-05-24

Identifiers

Local EPrints ID: 422907
URI: https://eprints.soton.ac.uk/id/eprint/422907
PURE UUID: 6edf3499-26f2-4d17-9d23-b108dbe8f791
ORCID for Thomas Andritsch: ORCID iD orcid.org/0000-0002-3462-022X
ORCID for Alun S. Vaughan: ORCID iD orcid.org/0000-0002-0535-513X

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Date deposited: 07 Aug 2018 16:31
Last modified: 08 Oct 2019 00:49

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Contributors

Author: Istebreq A. Saeedi
Author: Thomas Andritsch ORCID iD
Author: Alun S. Vaughan ORCID iD
Author: Daniel J. Salter

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