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Finite element analysis (FEA) modelling and experimental verification to optimise flexible electronic packaging for e-textiles

Finite element analysis (FEA) modelling and experimental verification to optimise flexible electronic packaging for e-textiles
Finite element analysis (FEA) modelling and experimental verification to optimise flexible electronic packaging for e-textiles
In this paper a three-dimensional model of a novel electronic package has been developed using Finite element analysis to evaluate the shear load, tensile, bending and thermal stresses. Simulations of a complete flexible flip chip electronic packaging method are performed to minimize stresses on the packaged electronic device to improve robustness and reliability. Three component under-fill adhesives (Loctite 4860, Loctite 480 and Loctite 4902) and three circuit substrate materials (Kapton, Mylar and PEEK) are compared and the optimal thickness of each is found by shear load, tensile load, bending test and thermal expansion simulations. A fixed die size of 3.5 mm × 8 mm × 0.53 mm has been simulated and evaluated experimentally under shear and bending load. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. The Kapton substrate together with the Loctite 4902 adhesive were identified as the optimum in the simulation. The simulation of under-fill adhesive and substrate thickness identified an optimum configuration of a 0.045–0.052 mm thick substrate layer and a 0.042–0.045 mm thickness of the Loctite 4902 adhesive. The bending simulation has also been used to determine the neutral axis of the encapsulated electronic package in this paper, thus identifying the optimal material and thickness for the encapsulation layer of the package.
0946-7076
Li, Menglong
23dd02ab-027d-46ca-a8eb-ac9b73f3916f
Torah, Russel
7147b47b-db01-4124-95dc-90d6a9842688
Liu, Jingqi
68b025ba-d643-40bc-848d-09aaff4a492f
Tudor, Michael
46eea408-2246-4aa0-8b44-86169ed601ff
Beeby, Stephen
ba565001-2812-4300-89f1-fe5a437ecb0d
Li, Menglong
23dd02ab-027d-46ca-a8eb-ac9b73f3916f
Torah, Russel
7147b47b-db01-4124-95dc-90d6a9842688
Liu, Jingqi
68b025ba-d643-40bc-848d-09aaff4a492f
Tudor, Michael
46eea408-2246-4aa0-8b44-86169ed601ff
Beeby, Stephen
ba565001-2812-4300-89f1-fe5a437ecb0d

Li, Menglong, Torah, Russel, Liu, Jingqi, Tudor, Michael and Beeby, Stephen (2020) Finite element analysis (FEA) modelling and experimental verification to optimise flexible electronic packaging for e-textiles. Microsystem Technologies. (doi:10.1007/s00542-020-04813-w).

Record type: Article

Abstract

In this paper a three-dimensional model of a novel electronic package has been developed using Finite element analysis to evaluate the shear load, tensile, bending and thermal stresses. Simulations of a complete flexible flip chip electronic packaging method are performed to minimize stresses on the packaged electronic device to improve robustness and reliability. Three component under-fill adhesives (Loctite 4860, Loctite 480 and Loctite 4902) and three circuit substrate materials (Kapton, Mylar and PEEK) are compared and the optimal thickness of each is found by shear load, tensile load, bending test and thermal expansion simulations. A fixed die size of 3.5 mm × 8 mm × 0.53 mm has been simulated and evaluated experimentally under shear and bending load. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. The Kapton substrate together with the Loctite 4902 adhesive were identified as the optimum in the simulation. The simulation of under-fill adhesive and substrate thickness identified an optimum configuration of a 0.045–0.052 mm thick substrate layer and a 0.042–0.045 mm thickness of the Loctite 4902 adhesive. The bending simulation has also been used to determine the neutral axis of the encapsulated electronic package in this paper, thus identifying the optimal material and thickness for the encapsulation layer of the package.

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More information

Submitted date: 2018
Accepted/In Press date: 11 March 2020
e-pub ahead of print date: 14 March 2020

Identifiers

Local EPrints ID: 423253
URI: http://eprints.soton.ac.uk/id/eprint/423253
ISSN: 0946-7076
PURE UUID: ccb938f8-04bc-421e-a505-961822a39c5b
ORCID for Russel Torah: ORCID iD orcid.org/0000-0002-5598-2860
ORCID for Michael Tudor: ORCID iD orcid.org/0000-0003-1179-9455
ORCID for Stephen Beeby: ORCID iD orcid.org/0000-0002-0800-1759

Catalogue record

Date deposited: 19 Sep 2018 16:31
Last modified: 15 Sep 2021 01:49

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Contributors

Author: Menglong Li
Author: Russel Torah ORCID iD
Author: Jingqi Liu
Author: Michael Tudor ORCID iD
Author: Stephen Beeby ORCID iD

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