READ ME File For Data-set supporting the article entitled "Design and Optimisation of Inductive Coupling Links for 3D-ICs"

Readme author: Benjamin J. Fletcher, University of Southampton

This dataset supports the article entitled "Design and Optimisation of Inductive Coupling Links for 3D-ICs" accepted for publication in IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

Data Supporting Figures:

Fig. 8: (a) Variation of η with respect to n (D = 200 µm, w=3 µm and s = 1 µm). (b) Variation of η with respect to f (D = 200 µm, w=3 µm and s = 1 µm).

Fig. 9: The effects of turn-width graduation, χw, and turn-spacing graduation, χs, on efficiency (η) when (a) D = 200 µm, n = 4, and (b) D = 300 µm, n = 7.

Fig. 10: The effects of tuning turn-width graduation, χw, and turn-spacing graduation, χs to maximise η.

Fig. 11: Transient simulation comparing the performance of broadband fitted SPICE channel model (generated by Ansys HFSS) and the simplified channel model (Shown in Fig.1) used in this work.

Fig. 12: Mutual inductance extraction accuracy as n varies (D=300 µm, w=1.5 µm, s=1 µm for both coils).

TABLE II: Semi-empirical expression accuracy evaluation of COIL-3D for parameters L , R and C compared with existing approaches

TABLE III: Execution overheads of the proposed electrical parameter expressions (when evaluating η) compared with existing approaches.

TABLE IV: Total optimisation time using COIL-3D and other approaches.

Fig. 15: Performance ((a) required transmit pulse power and (b) achievable bandwidth) of the inductor layout used in our previous work [36] compared with COIL-3D optimised solution

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Dataset available under a CC BY 4.0 licence

Publisher: University of Southampton, U.K.

Date: November 2018