Micro-embossing formability of a superlight dual-phase Mg-Li alloy processed by high-pressure torsion
Micro-embossing formability of a superlight dual-phase Mg-Li alloy processed by high-pressure torsion
Micro‐embossing tests are performed on a coarse‐grained (CG) and an ultrafine‐grained (UFG) dual‐phase Mg–Li alloy processed by high‐pressure torsion (HPT) using different widths of the female die at ambient temperature under a force of 9 kN. The surface topography, rib profiles, and microstructures of the cross‐sections are measured by scanning electron microscopy, confocal scanning laser microscopy, and optical microscopy, respectively. The interactive effects of the cavity widths of the female die and dual phases on the formability of micro‐embossing are analyzed. Numerical simulations are performed to study the effects of the dual‐phases on the filling behavior of the CG and UFG alloys. The results show that a UFG Mg–Li alloy reduces the adverse effects of dual phases on the formability of micro‐embossing. Micro‐channel arrays with channel widths ranging from 50 to 200 µm are fabricated with good geometrical accuracy using a UFG dual‐phase alloy at ambient temperature, thereby establishing the excellent potential for using UFG dual‐phase Mg–Li alloys processed by HPT for applications in micro‐forming.
dual-phase microsructures, high-pressure torsion, Mg-Li alloy, micro-embossing, micro-forming
1-11
Xu, Jie
593871b5-a17a-4e0f-ae0e-7e48b1aadd99
Sui, Qian
9b9e1ad9-de0a-4eea-8280-9160b0083617
Wang, Chenxi
86ad4b4b-2e95-448a-812c-6c68a4e7f5b0
Wang, Xinwei
581ee74f-f1e2-4fc3-9868-e1a4e28f98d1
Shan, Debin
fd8652eb-1eeb-4ae2-bcc4-102320f3c2d7
Guo, Bin
6454155d-fa5f-480b-8747-88d06498a923
Langdon, Terence G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86
20 February 2019
Xu, Jie
593871b5-a17a-4e0f-ae0e-7e48b1aadd99
Sui, Qian
9b9e1ad9-de0a-4eea-8280-9160b0083617
Wang, Chenxi
86ad4b4b-2e95-448a-812c-6c68a4e7f5b0
Wang, Xinwei
581ee74f-f1e2-4fc3-9868-e1a4e28f98d1
Shan, Debin
fd8652eb-1eeb-4ae2-bcc4-102320f3c2d7
Guo, Bin
6454155d-fa5f-480b-8747-88d06498a923
Langdon, Terence G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86
Xu, Jie, Sui, Qian, Wang, Chenxi, Wang, Xinwei, Shan, Debin, Guo, Bin and Langdon, Terence G.
(2019)
Micro-embossing formability of a superlight dual-phase Mg-Li alloy processed by high-pressure torsion.
Advanced Engineering Materials, 21 (2), , [1800961].
(doi:10.1002/adem.201800961).
Abstract
Micro‐embossing tests are performed on a coarse‐grained (CG) and an ultrafine‐grained (UFG) dual‐phase Mg–Li alloy processed by high‐pressure torsion (HPT) using different widths of the female die at ambient temperature under a force of 9 kN. The surface topography, rib profiles, and microstructures of the cross‐sections are measured by scanning electron microscopy, confocal scanning laser microscopy, and optical microscopy, respectively. The interactive effects of the cavity widths of the female die and dual phases on the formability of micro‐embossing are analyzed. Numerical simulations are performed to study the effects of the dual‐phases on the filling behavior of the CG and UFG alloys. The results show that a UFG Mg–Li alloy reduces the adverse effects of dual phases on the formability of micro‐embossing. Micro‐channel arrays with channel widths ranging from 50 to 200 µm are fabricated with good geometrical accuracy using a UFG dual‐phase alloy at ambient temperature, thereby establishing the excellent potential for using UFG dual‐phase Mg–Li alloys processed by HPT for applications in micro‐forming.
Text
Xu-aem-journal-S-18-01225
- Accepted Manuscript
More information
Accepted/In Press date: 23 November 2018
e-pub ahead of print date: 26 November 2018
Published date: 20 February 2019
Keywords:
dual-phase microsructures, high-pressure torsion, Mg-Li alloy, micro-embossing, micro-forming
Identifiers
Local EPrints ID: 426793
URI: http://eprints.soton.ac.uk/id/eprint/426793
ISSN: 1438-1656
PURE UUID: b62a3db4-2f59-4569-a33c-20c75e7c2c9b
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Date deposited: 12 Dec 2018 17:30
Last modified: 16 Mar 2024 07:23
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Contributors
Author:
Jie Xu
Author:
Qian Sui
Author:
Chenxi Wang
Author:
Xinwei Wang
Author:
Debin Shan
Author:
Bin Guo
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