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CoDAPT: a concurrent data and power transceiver for fully wireless 3D-ICs

CoDAPT: a concurrent data and power transceiver for fully wireless 3D-ICs
CoDAPT: a concurrent data and power transceiver for fully wireless 3D-ICs
Three dimensional system integration is a promising enabling technology for realising heterogeneous ICs, facilitating stacking of disparate elements such as MEMS, sensors, analogue components, memories and digital processing. Recently, research has looked to contactless 3D integration using inductive coupling links (ICLs) to provide a low-cost alternative to conventional contact-based approaches (e.g. through silicon vias) for 3D integration. In this paper, we present a novel, fully wireless, ICL architecture for Concurrent Data and Power Transfer (CoDAPT) between tiers of a 3D-IC. The proposed CoDAPT architecture uses only a single inductor for simultaneous power transmission and data communication, resulting in high area efficiency, whilst facilitating low-cost, straightforward die stacking. The proposed design is experimentally validated through full wave EM and SPICE simulation and demonstrates capability to communicate data vertically at a rate of 1.3Gbps/channel (utilising an area of only 0.052mm2) whilst simultaneously achieving power delivery of 0.83mW, under standard operating conditions. A case study is also presented, demonstrating that CoDAPT achieves an area reduction greater than 1.7x when compared with existing works, representing an important progression towards ultra low-cost 3D-ICs through fully wireless stacking.
3D-IC, Inductive Power Transfer, Inductor
1558-1101
IEEE
Fletcher, Benjamin, James
b9ee2f3f-f125-47df-a73e-e61c0404d4c9
Das, Shidhartha
c1e693af-261c-495d-8f0f-227396df0e3b
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53
Fletcher, Benjamin, James
b9ee2f3f-f125-47df-a73e-e61c0404d4c9
Das, Shidhartha
c1e693af-261c-495d-8f0f-227396df0e3b
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53

Fletcher, Benjamin, James, Das, Shidhartha and Mak, Terrence (2019) CoDAPT: a concurrent data and power transceiver for fully wireless 3D-ICs. In 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE). IEEE. 6 pp . (doi:10.23919/DATE.2019.8714863).

Record type: Conference or Workshop Item (Paper)

Abstract

Three dimensional system integration is a promising enabling technology for realising heterogeneous ICs, facilitating stacking of disparate elements such as MEMS, sensors, analogue components, memories and digital processing. Recently, research has looked to contactless 3D integration using inductive coupling links (ICLs) to provide a low-cost alternative to conventional contact-based approaches (e.g. through silicon vias) for 3D integration. In this paper, we present a novel, fully wireless, ICL architecture for Concurrent Data and Power Transfer (CoDAPT) between tiers of a 3D-IC. The proposed CoDAPT architecture uses only a single inductor for simultaneous power transmission and data communication, resulting in high area efficiency, whilst facilitating low-cost, straightforward die stacking. The proposed design is experimentally validated through full wave EM and SPICE simulation and demonstrates capability to communicate data vertically at a rate of 1.3Gbps/channel (utilising an area of only 0.052mm2) whilst simultaneously achieving power delivery of 0.83mW, under standard operating conditions. A case study is also presented, demonstrating that CoDAPT achieves an area reduction greater than 1.7x when compared with existing works, representing an important progression towards ultra low-cost 3D-ICs through fully wireless stacking.

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CoDAPT - Accepted Manuscript
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More information

e-pub ahead of print date: March 2019
Published date: 16 May 2019
Venue - Dates: Design Automation and Test in Europe 2019, Florence, Italy, 2019-03-25 - 2019-03-29
Keywords: 3D-IC, Inductive Power Transfer, Inductor

Identifiers

Local EPrints ID: 427820
URI: https://eprints.soton.ac.uk/id/eprint/427820
ISSN: 1558-1101
PURE UUID: bc136d85-f967-46cc-80b1-a201e8f7ca35
ORCID for Benjamin, James Fletcher: ORCID iD orcid.org/0000-0002-4957-1934

Catalogue record

Date deposited: 29 Jan 2019 17:30
Last modified: 18 Jun 2019 00:25

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Contributors

Author: Benjamin, James Fletcher ORCID iD
Author: Shidhartha Das
Author: Terrence Mak

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