IBII test for high strain rate tensile testing of adhesives
IBII test for high strain rate tensile testing of adhesives
This paper presents the application of the new Image-Based Inertial Impact (IBII) test methodology to study the high strain rate response of adhesives. It relies on an inertial impact (spalling-like) test configuration and the use of ultra-high speed imaging to record the deformation of the test specimen in the MHz range. The underlying novelty is to use the acceleration obtained from the time-resolved displacement maps to derive stress information leading to the identification of the material constitutive parameters. Here, an epoxy adhesive is tested at strain rates up to 1000 s
−1
and its modulus and tensile strength are successfully derived from just the deformed images.
Adhesive, High speed imaging, High strain rate, Impact, Virtual fields method
301-305
Guigue, A.
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Fletcher, L.
48dca64b-f93c-4655-9205-eaf4e74be90c
Seghir, R.
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Pierron, F.
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28 October 2018
Guigue, A.
1b9a0c58-119a-4d9d-ace6-8eb7b6cf40e1
Fletcher, L.
48dca64b-f93c-4655-9205-eaf4e74be90c
Seghir, R.
cd6555fb-7c90-46e2-b16a-1a6f0a666e59
Pierron, F.
a1fb4a70-6f34-4625-bc23-fcb6996b79b4
Guigue, A., Fletcher, L., Seghir, R. and Pierron, F.
(2018)
IBII test for high strain rate tensile testing of adhesives.
Kimberley, J., Lamberson, L. and Mates, S.
(eds.)
In Dynamic Behavior of Materials, Volume 1 - Proceedings of the 2018 Annual Conference on Experimental and Applied Mechanics.
Springer.
.
(doi:10.1007/978-3-319-95089-1_55).
Record type:
Conference or Workshop Item
(Paper)
Abstract
This paper presents the application of the new Image-Based Inertial Impact (IBII) test methodology to study the high strain rate response of adhesives. It relies on an inertial impact (spalling-like) test configuration and the use of ultra-high speed imaging to record the deformation of the test specimen in the MHz range. The underlying novelty is to use the acceleration obtained from the time-resolved displacement maps to derive stress information leading to the identification of the material constitutive parameters. Here, an epoxy adhesive is tested at strain rates up to 1000 s
−1
and its modulus and tensile strength are successfully derived from just the deformed images.
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More information
Published date: 28 October 2018
Venue - Dates:
SEM Annual Conference and Exposition on Experimental and Applied Mechanics, 2018, , Greenville, United States, 2018-06-04 - 2018-06-07
Keywords:
Adhesive, High speed imaging, High strain rate, Impact, Virtual fields method
Identifiers
Local EPrints ID: 428317
URI: http://eprints.soton.ac.uk/id/eprint/428317
PURE UUID: 3d5865aa-3cc3-4d1e-b00e-53d2ced33ced
Catalogue record
Date deposited: 21 Feb 2019 17:30
Last modified: 18 Mar 2024 03:15
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Contributors
Author:
A. Guigue
Author:
R. Seghir
Editor:
J. Kimberley
Editor:
L. Lamberson
Editor:
S. Mates
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