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Fatigue crack path prediction in Udimet 720 nickel based alloy single crystals

Reed, P.A.S., Wu, X.D. and Sinclair, I. (2000) Fatigue crack path prediction in Udimet 720 nickel based alloy single crystals Metallurgical and Materials Transactions A, 31, (1), pp. 109-123.

Record type: Article

Abstract

The effect of orientation, applied stress state, environment, and temperature on the crack growth and crack-path behavior of single-crystal specimens of UDIMET 720 has been examined. Stage I cracking has been promoted by mixed-mode loading, plank stress, and vacuum conditions; increasing the test temperature to 600 degrees C does not suppress stage I:crack growth in vacuum. Consideration of the local resolved shear-stress intensity and local resolved normal-stress intensity for each slip system as it intersects the nominal crack-growth plane allows-the prediction of stage I crack paths, clarifying the importance of secondary single-crystal testing orientation (i.e., nominal crack-growth direction as well as effective tensile axis). A combination of both opening and shearing are found to promote stage I crack growth, and boundary conditions,have been established within which stage I cracking is promoted. Highly deflected stage I cracking-gives rise to significant shielding effects, but under suitable mixed-mode loading, highly oriented, coplanar stage I crack growth can be produced. Intrinsic stage I cracking under mixed-mode loading appears to be greatly accelerated compared with mode I-dominated stage II crack growth for comparable stress-intensity levels.

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More information

Published date: 2000
Keywords: growth, microstructure, superalloys, propagation, temperature, behavior, fracture, stress
Organisations: Engineering Mats & Surface Engineerg Gp

Identifiers

Local EPrints ID: 43062
URI: http://eprints.soton.ac.uk/id/eprint/43062
ISSN: 1073-5623
PURE UUID: 85a0ed41-62cc-487c-9cdf-fccf7b733b9f
ORCID for P.A.S. Reed: ORCID iD orcid.org/0000-0002-2258-0347

Catalogue record

Date deposited: 10 Jan 2007
Last modified: 17 Jul 2017 15:20

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Contributors

Author: P.A.S. Reed ORCID iD
Author: X.D. Wu
Author: I. Sinclair

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