Total dose radiation hardening of MOS transistors by fluorine implantation
Total dose radiation hardening of MOS transistors by fluorine implantation
Total ionizing dose effects are predominantly due to hole traps at the Si/SiO
2
interface at the shallow trench isolation (STI) and buried oxide. Here we show that Fluorine ion implantation is capable to fully passivate those traps such that negligible threshold shift is discernible in NMOS transistors radiated up to a maximum dose of 1MRad (Si). H-gate transistor were designed and fabricated using thin gate oxide, source drain pull back and ion implanted Fluorine to address radiation effects in the gate oxide, STI and buried oxides respectively. The transistors hardness was tested using gamma radiation from a Co60 source. Transistors without fluorine show a threshold voltage shifts of up to 350mV. Fluorine doped transistors show negligible threshold shifts up to the maximum dose.
radiation hardness, total ionising dose
Shaw, Chris
76d8effd-a5f7-49ea-aa53-922c83edaf3a
Potter, Kenneth
bf204443-941c-4e35-ae89-2cb8f28fa1aa
Morgan, Katrina
2b9605fc-ac61-4ae7-b5f1-b6e3d257701d
Ashburn, Peter
68cef6b7-205b-47aa-9efb-f1f09f5c1038
De Groot, Kees
92cd2e02-fcc4-43da-8816-c86f966be90c
Redman-White, Bill
d5376167-c925-460f-8e9c-13bffda8e0bf
22 April 2019
Shaw, Chris
76d8effd-a5f7-49ea-aa53-922c83edaf3a
Potter, Kenneth
bf204443-941c-4e35-ae89-2cb8f28fa1aa
Morgan, Katrina
2b9605fc-ac61-4ae7-b5f1-b6e3d257701d
Ashburn, Peter
68cef6b7-205b-47aa-9efb-f1f09f5c1038
De Groot, Kees
92cd2e02-fcc4-43da-8816-c86f966be90c
Redman-White, Bill
d5376167-c925-460f-8e9c-13bffda8e0bf
Shaw, Chris, Potter, Kenneth, Morgan, Katrina, Ashburn, Peter, De Groot, Kees and Redman-White, Bill
(2019)
Total dose radiation hardening of MOS transistors by fluorine implantation.
In 2017 17th European Conference on Radiation and Its Effects on Components and Systems, RADECS 2017.
IEEE..
(doi:10.1109/RADECS.2017.8696125).
Record type:
Conference or Workshop Item
(Paper)
Abstract
Total ionizing dose effects are predominantly due to hole traps at the Si/SiO
2
interface at the shallow trench isolation (STI) and buried oxide. Here we show that Fluorine ion implantation is capable to fully passivate those traps such that negligible threshold shift is discernible in NMOS transistors radiated up to a maximum dose of 1MRad (Si). H-gate transistor were designed and fabricated using thin gate oxide, source drain pull back and ion implanted Fluorine to address radiation effects in the gate oxide, STI and buried oxides respectively. The transistors hardness was tested using gamma radiation from a Co60 source. Transistors without fluorine show a threshold voltage shifts of up to 350mV. Fluorine doped transistors show negligible threshold shifts up to the maximum dose.
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Published date: 22 April 2019
Venue - Dates:
17th European Conference on Radiation and Its Effects on Components and Systems, RADECS 2017, , Geneva, Switzerland, 2017-10-02 - 2017-10-06
Keywords:
radiation hardness, total ionising dose
Identifiers
Local EPrints ID: 431498
URI: http://eprints.soton.ac.uk/id/eprint/431498
PURE UUID: 8c8e828b-9285-4074-9ed3-3f01599ad7c3
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Date deposited: 06 Jun 2019 16:30
Last modified: 16 Mar 2024 04:05
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Contributors
Author:
Chris Shaw
Author:
Kenneth Potter
Author:
Katrina Morgan
Author:
Bill Redman-White
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