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A low-energy inductive transceiver using spike-latency encoding for wireless 3D integration

A low-energy inductive transceiver using spike-latency encoding for wireless 3D integration
A low-energy inductive transceiver using spike-latency encoding for wireless 3D integration
Recently, the use of wireless (or contactless) 3D integration has been proposed as a low-cost method of stacking disparate processing and sensor dies into singular, small formfactor ICs. Whilst such devices would be ideally suited for the Internet of Things (IoT), in the IoT, maintaining low-power consumption is of paramount importance. Contactless intertier links use significant energy when forming a magnetic field which can penetrate multiple silicon dies, and hence are often criticised for their poor power efficiency when compared to wired alternatives such as through silicon vias (TSVs). To address this, in this paper we present a novel, neuro-inspired, inductive transceiver (for transmitting data between tiers of a 3D-IC) that maintains low power consumption by encoding frames of data in terms of the latency between pulses, thereby reducing the number of transmit pulses and energy required per bit. The proposed approach is validated using commercial electromagnetic and electrical circuit simulators in 65nm CMOS technology. Results demonstrate an energy consumption of 0.79pJ/bit, representing a reduction of 31% when compared to existing state-of-the-art transceivers, or an increased communication distance of up to 1.8x for the same power budget.
Fletcher, Benjamin, James
b9ee2f3f-f125-47df-a73e-e61c0404d4c9
Das, Shidhartha
c1e693af-261c-495d-8f0f-227396df0e3b
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53
Fletcher, Benjamin, James
b9ee2f3f-f125-47df-a73e-e61c0404d4c9
Das, Shidhartha
c1e693af-261c-495d-8f0f-227396df0e3b
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53

Fletcher, Benjamin, James, Das, Shidhartha and Mak, Terrence (2019) A low-energy inductive transceiver using spike-latency encoding for wireless 3D integration. In ACM/IEEE International Symposium on Low Power Electronics and Design : ISLPED 2019. 6 pp . (doi:10.1109/ISLPED.2019.8824866).

Record type: Conference or Workshop Item (Paper)

Abstract

Recently, the use of wireless (or contactless) 3D integration has been proposed as a low-cost method of stacking disparate processing and sensor dies into singular, small formfactor ICs. Whilst such devices would be ideally suited for the Internet of Things (IoT), in the IoT, maintaining low-power consumption is of paramount importance. Contactless intertier links use significant energy when forming a magnetic field which can penetrate multiple silicon dies, and hence are often criticised for their poor power efficiency when compared to wired alternatives such as through silicon vias (TSVs). To address this, in this paper we present a novel, neuro-inspired, inductive transceiver (for transmitting data between tiers of a 3D-IC) that maintains low power consumption by encoding frames of data in terms of the latency between pulses, thereby reducing the number of transmit pulses and energy required per bit. The proposed approach is validated using commercial electromagnetic and electrical circuit simulators in 65nm CMOS technology. Results demonstrate an energy consumption of 0.79pJ/bit, representing a reduction of 31% when compared to existing state-of-the-art transceivers, or an increased communication distance of up to 1.8x for the same power budget.

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More information

Accepted/In Press date: 13 May 2019
Published date: 29 July 2019
Venue - Dates: ACM/IEEE International Symposium on Low Power Electronics and Design, EPFL, Lausanne, Switzerland, 2019-07-29 - 2019-07-31

Identifiers

Local EPrints ID: 431622
URI: http://eprints.soton.ac.uk/id/eprint/431622
PURE UUID: 4424d5f0-afea-4356-b210-9573314c7057
ORCID for Benjamin, James Fletcher: ORCID iD orcid.org/0000-0002-4957-1934

Catalogue record

Date deposited: 11 Jun 2019 16:30
Last modified: 16 Mar 2024 02:12

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Contributors

Author: Benjamin, James Fletcher ORCID iD
Author: Shidhartha Das
Author: Terrence Mak

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