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Dataset for Integrating Flexible Filament Circuits for E‐Textile Applications

Dataset for Integrating Flexible Filament Circuits for E‐Textile Applications
Dataset for Integrating Flexible Filament Circuits for E‐Textile Applications
Dataset supports: Komolafe, A. et al. (2019). Integrating Flexible Filament Circuits for E-Textile Applications. Advanced Materials Technologies. Practical wearable e‐textiles must be durable and retain, as far as possible, the textile properties such as drape, feel, lightweight, breathability, and washability that make fabrics suitable for clothing. Early e‐textile garments were realized by inserting standard portable electronic devices into bespoke pockets and arranging interconnects and cabling across the garment. In these examples, the textile merely served as a vehicle to house the electronics and had no inherent electronic functionality. A reduction in electronic component size, the development of flexible circuits, and the ability to weave robust interconnects offer the potential for improved levels of electronic integration within the textile. The weaving of electronic circuit filaments less than 2 mm wide into fabrics such that the electronics are fully concealed in the textile and given extra protection by the surrounding textile fibers is introduced. The failure mechanisms for different filament circuit designs before and after integration into the textile are investigated with a 90° cyclical bending test. Results show that encapsulated filament circuits embedded within the textile survive 45 washing cycles and more than 1500 cycles of 90° bending around a bending radius of 10 mm, performing five times better than equivalent filament circuits before integration into the fabric.
University of Southampton
Komolafe, Abiodun
5e79fbab-38be-4a64-94d5-867a94690932
Torah, Russel
7147b47b-db01-4124-95dc-90d6a9842688
Wei, Yang
c6d13914-4f35-459c-8c25-8f8b77b7c5b3
Nunes Matos, Helga
d57bf886-addc-4f55-ad10-3a947248aea8
Li, Menglong
23dd02ab-027d-46ca-a8eb-ac9b73f3916f
Hardy, Dorothy
4157fde4-390b-4d4b-92c7-574ab3fe97b6
Dias, Tilak
570e8dc8-5941-471e-9867-846bf518596c
Tudor, Michael
46eea408-2246-4aa0-8b44-86169ed601ff
Beeby, Stephen
ba565001-2812-4300-89f1-fe5a437ecb0d
Komolafe, Abiodun
5e79fbab-38be-4a64-94d5-867a94690932
Torah, Russel
7147b47b-db01-4124-95dc-90d6a9842688
Wei, Yang
c6d13914-4f35-459c-8c25-8f8b77b7c5b3
Nunes Matos, Helga
d57bf886-addc-4f55-ad10-3a947248aea8
Li, Menglong
23dd02ab-027d-46ca-a8eb-ac9b73f3916f
Hardy, Dorothy
4157fde4-390b-4d4b-92c7-574ab3fe97b6
Dias, Tilak
570e8dc8-5941-471e-9867-846bf518596c
Tudor, Michael
46eea408-2246-4aa0-8b44-86169ed601ff
Beeby, Stephen
ba565001-2812-4300-89f1-fe5a437ecb0d

Komolafe, Abiodun, Torah, Russel, Wei, Yang and Li, Menglong (2019) Dataset for Integrating Flexible Filament Circuits for E‐Textile Applications. University of Southampton doi:10.5258/SOTON/D0365 [Dataset]

Record type: Dataset

Abstract

Dataset supports: Komolafe, A. et al. (2019). Integrating Flexible Filament Circuits for E-Textile Applications. Advanced Materials Technologies. Practical wearable e‐textiles must be durable and retain, as far as possible, the textile properties such as drape, feel, lightweight, breathability, and washability that make fabrics suitable for clothing. Early e‐textile garments were realized by inserting standard portable electronic devices into bespoke pockets and arranging interconnects and cabling across the garment. In these examples, the textile merely served as a vehicle to house the electronics and had no inherent electronic functionality. A reduction in electronic component size, the development of flexible circuits, and the ability to weave robust interconnects offer the potential for improved levels of electronic integration within the textile. The weaving of electronic circuit filaments less than 2 mm wide into fabrics such that the electronics are fully concealed in the textile and given extra protection by the surrounding textile fibers is introduced. The failure mechanisms for different filament circuit designs before and after integration into the textile are investigated with a 90° cyclical bending test. Results show that encapsulated filament circuits embedded within the textile survive 45 washing cycles and more than 1500 cycles of 90° bending around a bending radius of 10 mm, performing five times better than equivalent filament circuits before integration into the fabric.

Spreadsheet
Test_result_for_bending.xlsx - Dataset
Available under License Creative Commons Attribution.
Download (11kB)
Text
Read_me_file.pdf - Text
Available under License Creative Commons Attribution.
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More information

Published date: 1 June 2019

Identifiers

Local EPrints ID: 431869
URI: http://eprints.soton.ac.uk/id/eprint/431869
PURE UUID: 10985341-008b-4be1-8a76-fc00d961a808
ORCID for Abiodun Komolafe: ORCID iD orcid.org/0000-0002-3618-2390
ORCID for Russel Torah: ORCID iD orcid.org/0000-0002-5598-2860
ORCID for Yang Wei: ORCID iD orcid.org/0000-0001-6195-8595
ORCID for Michael Tudor: ORCID iD orcid.org/0000-0003-1179-9455
ORCID for Stephen Beeby: ORCID iD orcid.org/0000-0002-0800-1759

Catalogue record

Date deposited: 19 Jun 2019 16:32
Last modified: 18 Apr 2024 01:45

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Contributors

Creator: Abiodun Komolafe ORCID iD
Creator: Russel Torah ORCID iD
Creator: Yang Wei ORCID iD
Contributor: Helga Nunes Matos
Creator: Menglong Li
Contributor: Dorothy Hardy
Contributor: Tilak Dias
Research team head: Michael Tudor ORCID iD
Research team head: Stephen Beeby ORCID iD

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