The University of Southampton
University of Southampton Institutional Repository

A 10.8pJ/bit pulse-position inductive transceiver for low-energy wireless 3D integration

A 10.8pJ/bit pulse-position inductive transceiver for low-energy wireless 3D integration
A 10.8pJ/bit pulse-position inductive transceiver for low-energy wireless 3D integration
This paper presents a low-energy die-to-die inductive transceiver for use within a stacked 3D-IC. The design is implemented in a 2-tier 0.35µm CMOS test chip and demonstrates vertical communication at a rate of 133Mbps/channel, across a distance of 110µm, whilst consuming only 10.8pJ per transmitted bit. This represents a 5.3x improvement when compared to state-of-the-art inductive transceivers by combining: (1) 3-ary pulse-position modulation, to encode data in terms of the latency between sequential pulses (rather than using one-to-one pulsecode mappings), and (2) A tunable current driver circuit to adjust the transmit current dynamically based on the quality of the stacked die assembly.
IEEE
Fletcher, Benjamin, James
b9ee2f3f-f125-47df-a73e-e61c0404d4c9
Das, Shidhartha
c1e693af-261c-495d-8f0f-227396df0e3b
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53
Fletcher, Benjamin, James
b9ee2f3f-f125-47df-a73e-e61c0404d4c9
Das, Shidhartha
c1e693af-261c-495d-8f0f-227396df0e3b
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53

Fletcher, Benjamin, James, Das, Shidhartha and Mak, Terrence (2019) A 10.8pJ/bit pulse-position inductive transceiver for low-energy wireless 3D integration. In IEEE European Solid-State Circuits Conference (ESSCIRC). vol. 49, IEEE. 4 pp .

Record type: Conference or Workshop Item (Paper)

Abstract

This paper presents a low-energy die-to-die inductive transceiver for use within a stacked 3D-IC. The design is implemented in a 2-tier 0.35µm CMOS test chip and demonstrates vertical communication at a rate of 133Mbps/channel, across a distance of 110µm, whilst consuming only 10.8pJ per transmitted bit. This represents a 5.3x improvement when compared to state-of-the-art inductive transceivers by combining: (1) 3-ary pulse-position modulation, to encode data in terms of the latency between sequential pulses (rather than using one-to-one pulsecode mappings), and (2) A tunable current driver circuit to adjust the transmit current dynamically based on the quality of the stacked die assembly.

Text
ESSCIRC_paper_camera_ready - Accepted Manuscript
Download (2MB)

More information

Published date: September 2019
Venue - Dates: 49th IEEE European Solid-State Circuits Conference (ESSCIRC), Poland, 2019-09-23 - 2019-09-26

Identifiers

Local EPrints ID: 432501
URI: http://eprints.soton.ac.uk/id/eprint/432501
PURE UUID: fb6cc8cc-d450-4bcc-9bd7-920350b9b781
ORCID for Benjamin, James Fletcher: ORCID iD orcid.org/0000-0002-4957-1934

Catalogue record

Date deposited: 17 Jul 2019 16:30
Last modified: 13 May 2020 04:01

Export record

Contributors

Author: Benjamin, James Fletcher ORCID iD
Author: Shidhartha Das
Author: Terrence Mak

University divisions

Download statistics

Downloads from ePrints over the past year. Other digital versions may also be available to download e.g. from the publisher's website.

View more statistics

Atom RSS 1.0 RSS 2.0

Contact ePrints Soton: eprints@soton.ac.uk

ePrints Soton supports OAI 2.0 with a base URL of http://eprints.soton.ac.uk/cgi/oai2

This repository has been built using EPrints software, developed at the University of Southampton, but available to everyone to use.

We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we will assume that you are happy to receive cookies on the University of Southampton website.

×