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3D vertical directional coupler using slope waveguides on Si

3D vertical directional coupler using slope waveguides on Si
3D vertical directional coupler using slope waveguides on Si
3D multilayer photonics platform integrated with bulk Si or SOI can enable intra-chip optical connections and data processing without interfering with the on-chip electronics. Multi-layer integration has the potential to increase device density, offers more functionality in terms of novel materials and devices stacked in a multilayer assembly. It has been shown that interlayer coupling can be achieved by creating slopes between the two layers [1-3]. In this work, fabrication and preliminary characterisation of vertical directional coupler is demonstrated for optical signal distribution between two Si layers of the device. Lumerical was used to simulate waveguide geometry and coupling length. The bottom waveguide layer was fabricated on a 400nm SOI using e-beam lithography and inductively coupled plasma (ICP) etching. Fully etched waveguides of width 500nm were fabricated with input and output gratings for light coupling. This is followed by deposition of 1 μm thick SiO2 on the waveguide and the geometry was planarised using chemical mechanical polishing (CMP) leaving 100 nm oxide on top of the bottom waveguide layer. A 10 nm silicon nitride layer was deposited on it as etch-stop layer for buffered HF. Then another 1μm thick layer of SiO2 is deposited and interlayer slope angle of 13.4º was formed using HF wet etch. Next, a 400 nm of low-loss amorphous Si (a-Si) was deposited by hot-wire chemical vapour deposition (HWCVD) [4] and waveguides with similar dimensions to that of bottom layer were fabricated and capped with another 1μm of oxide. &more...
OSA
Mittal, Vinita
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Tarazona, Antulio
c6ae87c5-c746-4f89-9ff0-9e7b6874e94f
Khokhar, Ali
2eedd1cc-8ac5-4f8e-be25-930bd3eae396
Banakar, Mehdi
ad56fc0a-728c-4abb-8be5-74318bb2758e
Thomson, David
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Reed, Graham
ca08dd60-c072-4d7d-b254-75714d570139
Chong, Harold
795aa67f-29e5-480f-b1bc-9bd5c0d558e1
Mittal, Vinita
fd5ee9dd-7770-416f-8f47-50ca158b39b0
Tarazona, Antulio
c6ae87c5-c746-4f89-9ff0-9e7b6874e94f
Khokhar, Ali
2eedd1cc-8ac5-4f8e-be25-930bd3eae396
Banakar, Mehdi
ad56fc0a-728c-4abb-8be5-74318bb2758e
Thomson, David
17c1626c-2422-42c6-98e0-586ae220bcda
Reed, Graham
ca08dd60-c072-4d7d-b254-75714d570139
Chong, Harold
795aa67f-29e5-480f-b1bc-9bd5c0d558e1

Mittal, Vinita, Tarazona, Antulio, Khokhar, Ali, Banakar, Mehdi, Thomson, David, Reed, Graham and Chong, Harold (2019) 3D vertical directional coupler using slope waveguides on Si. In CLEO/Europe-EQEC 2019. OSA.. (In Press)

Record type: Conference or Workshop Item (Paper)

Abstract

3D multilayer photonics platform integrated with bulk Si or SOI can enable intra-chip optical connections and data processing without interfering with the on-chip electronics. Multi-layer integration has the potential to increase device density, offers more functionality in terms of novel materials and devices stacked in a multilayer assembly. It has been shown that interlayer coupling can be achieved by creating slopes between the two layers [1-3]. In this work, fabrication and preliminary characterisation of vertical directional coupler is demonstrated for optical signal distribution between two Si layers of the device. Lumerical was used to simulate waveguide geometry and coupling length. The bottom waveguide layer was fabricated on a 400nm SOI using e-beam lithography and inductively coupled plasma (ICP) etching. Fully etched waveguides of width 500nm were fabricated with input and output gratings for light coupling. This is followed by deposition of 1 μm thick SiO2 on the waveguide and the geometry was planarised using chemical mechanical polishing (CMP) leaving 100 nm oxide on top of the bottom waveguide layer. A 10 nm silicon nitride layer was deposited on it as etch-stop layer for buffered HF. Then another 1μm thick layer of SiO2 is deposited and interlayer slope angle of 13.4º was formed using HF wet etch. Next, a 400 nm of low-loss amorphous Si (a-Si) was deposited by hot-wire chemical vapour deposition (HWCVD) [4] and waveguides with similar dimensions to that of bottom layer were fabricated and capped with another 1μm of oxide. &more...

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Accepted/In Press date: June 2019
Venue - Dates: Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference 2019, Munich, Germany, 2019-06-23 - 2019-06-27

Identifiers

Local EPrints ID: 433021
URI: https://eprints.soton.ac.uk/id/eprint/433021
PURE UUID: 79c623b7-c723-404b-a62e-391312080112
ORCID for Vinita Mittal: ORCID iD orcid.org/0000-0003-4836-5327
ORCID for Harold Chong: ORCID iD orcid.org/0000-0002-7110-5761

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Date deposited: 06 Aug 2019 16:30
Last modified: 07 Aug 2019 00:39

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Contributors

Author: Vinita Mittal ORCID iD
Author: Ali Khokhar
Author: Mehdi Banakar
Author: David Thomson
Author: Graham Reed
Author: Harold Chong ORCID iD

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