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Thermal stability of epoxy nanocomposites: surface treatment and morphology impact based on nano SiO2 and hBN fillers

Thermal stability of epoxy nanocomposites: surface treatment and morphology impact based on nano SiO2 and hBN fillers
Thermal stability of epoxy nanocomposites: surface treatment and morphology impact based on nano SiO2 and hBN fillers
Epoxy resin is one of the most commonly used thermosetting macromolecular synthetic materials. It displays excellent adhesiveness properties, good dielectric property, mechanical property and chemical stability. Consequently, epoxy resins have been widely used for many industrial purposes, such as electrical casting into power transformers, ignition coil systems and potting. In this paper, TGA and DSC measurements were carried out to evaluate the thermal stability of epoxy nanocomposites. Based on the results of dispersion and distribution of particles within epoxy nanocomposites, it concluded that both presences of nano SiO2 and hexagonal BN (hBN) particles have obvious impact on base materials in which the influences of latter particle are much more significant due to its shape, and thus both fillers leads to worse thermal stability than pure samples. However, particles could act as flame retardants in polymer nanocomposites and postpone the initiation of decomposition by hindering/slowing the oxidisation. When compared within two SiO2 based nanocomposites, the surface treatment seems to help mitigate the influences on base materials by achieving better filler dispersion and modify the cross-linking density at the interfacial areas by removing surface functional groups.
1-18
Qiang, Dayuan
2a64f637-fc33-4722-ab29-4e8fd60895a1
Wang, Xinyu
b0de6d39-87db-4bda-a097-a8ec50804a4a
Wang, Yan
f64021d0-1658-417b-93a7-b59055bd76f9
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c
Chen, Guanghui
3de45a9c-6c9a-4bcb-90c3-d7e26be21819
Qiang, Dayuan
2a64f637-fc33-4722-ab29-4e8fd60895a1
Wang, Xinyu
b0de6d39-87db-4bda-a097-a8ec50804a4a
Wang, Yan
f64021d0-1658-417b-93a7-b59055bd76f9
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c
Chen, Guanghui
3de45a9c-6c9a-4bcb-90c3-d7e26be21819

Qiang, Dayuan, Wang, Xinyu, Wang, Yan, Andritsch, Thomas and Chen, Guanghui (2019) Thermal stability of epoxy nanocomposites: surface treatment and morphology impact based on nano SiO2 and hBN fillers. Materials Research Express, 6 (10), 1-18. (doi:10.1088/2053-1591/ab3f8f).

Record type: Article

Abstract

Epoxy resin is one of the most commonly used thermosetting macromolecular synthetic materials. It displays excellent adhesiveness properties, good dielectric property, mechanical property and chemical stability. Consequently, epoxy resins have been widely used for many industrial purposes, such as electrical casting into power transformers, ignition coil systems and potting. In this paper, TGA and DSC measurements were carried out to evaluate the thermal stability of epoxy nanocomposites. Based on the results of dispersion and distribution of particles within epoxy nanocomposites, it concluded that both presences of nano SiO2 and hexagonal BN (hBN) particles have obvious impact on base materials in which the influences of latter particle are much more significant due to its shape, and thus both fillers leads to worse thermal stability than pure samples. However, particles could act as flame retardants in polymer nanocomposites and postpone the initiation of decomposition by hindering/slowing the oxidisation. When compared within two SiO2 based nanocomposites, the surface treatment seems to help mitigate the influences on base materials by achieving better filler dispersion and modify the cross-linking density at the interfacial areas by removing surface functional groups.

Text
MRX-115782_Revised - Accepted Manuscript
Restricted to Repository staff only until 29 August 2020.
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More information

Accepted/In Press date: 29 August 2019
e-pub ahead of print date: 29 August 2019
Published date: 6 September 2019

Identifiers

Local EPrints ID: 433763
URI: https://eprints.soton.ac.uk/id/eprint/433763
PURE UUID: 2d84da5e-3fe6-42f7-bbe5-2d02aa89fa9b
ORCID for Xinyu Wang: ORCID iD orcid.org/0000-0001-9434-2906
ORCID for Thomas Andritsch: ORCID iD orcid.org/0000-0002-3462-022X

Catalogue record

Date deposited: 03 Sep 2019 16:30
Last modified: 12 Oct 2019 00:32

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