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Estimating the surface adhesion force using pull-in/-out hysteresis in comb-drive devices

Estimating the surface adhesion force using pull-in/-out hysteresis in comb-drive devices
Estimating the surface adhesion force using pull-in/-out hysteresis in comb-drive devices

Surface adhesion forces play a critical role in the operation of NEM relays, but characterization data for micro/nanoscale contact areas of relevant materials are scarce. A novel technique to estimate the adhesion force between two contacting surfaces is presented. This method uses the hysteresis in the pull-in/-out voltages measured experimentally in electrostatically actuated comb-drive and circular NEM devices with two contacting electrodes. In these geometries the electrostatic actuation force is independent of the device displacement and the surface adhesion forces can be analytically calculated from the force balance describing the pull-out event. Finite-element ANSYS simulations of the electromechanical behavior of the devices support the analytical approach. Adhesion forces of 0.081 μN and 0.167 μN were calculated for Au-Au and Ti-Ti contacts with areas of 750 nm × 300 nm and 100 nm × 300 nm, respectively.

circular relays, comb-drive resonators, hysteresis, pull-in/-out voltages, Surface adhesion forces
1981-1984
Institute of Electrical and Electronics Engineers Inc.
Mouro, Joao
ad37ac45-f4bb-4d95-96c4-3f64f885ac29
Rana, Sunil
16726f81-3e09-45e4-b07b-944e7679e8ca
Reynolds, Jamie
96faa744-02ee-458c-8e48-953ea9e54afe
Chong, Harold
795aa67f-29e5-480f-b1bc-9bd5c0d558e1
Pamunuwa, DInesh
cf57fb7f-b05a-48d0-a9ef-2aca5f411cc3
Mouro, Joao
ad37ac45-f4bb-4d95-96c4-3f64f885ac29
Rana, Sunil
16726f81-3e09-45e4-b07b-944e7679e8ca
Reynolds, Jamie
96faa744-02ee-458c-8e48-953ea9e54afe
Chong, Harold
795aa67f-29e5-480f-b1bc-9bd5c0d558e1
Pamunuwa, DInesh
cf57fb7f-b05a-48d0-a9ef-2aca5f411cc3

Mouro, Joao, Rana, Sunil, Reynolds, Jamie, Chong, Harold and Pamunuwa, DInesh (2019) Estimating the surface adhesion force using pull-in/-out hysteresis in comb-drive devices. In 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc. pp. 1981-1984 . (doi:10.1109/TRANSDUCERS.2019.8808684).

Record type: Conference or Workshop Item (Paper)

Abstract

Surface adhesion forces play a critical role in the operation of NEM relays, but characterization data for micro/nanoscale contact areas of relevant materials are scarce. A novel technique to estimate the adhesion force between two contacting surfaces is presented. This method uses the hysteresis in the pull-in/-out voltages measured experimentally in electrostatically actuated comb-drive and circular NEM devices with two contacting electrodes. In these geometries the electrostatic actuation force is independent of the device displacement and the surface adhesion forces can be analytically calculated from the force balance describing the pull-out event. Finite-element ANSYS simulations of the electromechanical behavior of the devices support the analytical approach. Adhesion forces of 0.081 μN and 0.167 μN were calculated for Au-Au and Ti-Ti contacts with areas of 750 nm × 300 nm and 100 nm × 300 nm, respectively.

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More information

e-pub ahead of print date: 23 June 2019
Published date: 22 August 2019
Venue - Dates: 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, Berlin, Germany, 2019-06-23 - 2019-06-27
Keywords: circular relays, comb-drive resonators, hysteresis, pull-in/-out voltages, Surface adhesion forces

Identifiers

Local EPrints ID: 434488
URI: http://eprints.soton.ac.uk/id/eprint/434488
PURE UUID: c8ff4b12-0b40-4845-8353-b8bc3569b7ae
ORCID for Jamie Reynolds: ORCID iD orcid.org/0000-0002-0072-0134
ORCID for Harold Chong: ORCID iD orcid.org/0000-0002-7110-5761

Catalogue record

Date deposited: 25 Sep 2019 16:30
Last modified: 22 Oct 2019 00:42

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