Modelling reliable electrical conductors for e-textile circuits on polyamide filaments
Modelling reliable electrical conductors for e-textile circuits on polyamide filaments
The weaving of flexible electronic filaments directly into the body of textiles during manufacture represents the state-of-the-art process for integrating electronic functionality into fabrics in a manner that obscures the presence of the electronics from the wearer. The reliability of emerging prototypes under typical stresses from washing and bending is primarily dependent on the durability of the electrical conductors, and their interconnections with the electronic components attached to them on polyimide filaments. To improve the durability of these filaments, this paper uses the classical beam theory to investigate the material characteristics (thickness and elastic modulus) and suitability of different encapsulations such as polyimide, polyurethane, mylar and peek films for limiting the mechanical stress on the electrical conductors.
Komolafe, Abiodun
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Torah, Russel
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Tudor, Michael
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Beeby, Stephen
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Komolafe, Abiodun
5e79fbab-38be-4a64-94d5-867a94690932
Torah, Russel
7147b47b-db01-4124-95dc-90d6a9842688
Tudor, Michael
46eea408-2246-4aa0-8b44-86169ed601ff
Beeby, Stephen
ba565001-2812-4300-89f1-fe5a437ecb0d
Komolafe, Abiodun, Torah, Russel, Tudor, Michael and Beeby, Stephen
(2019)
Modelling reliable electrical conductors for e-textile circuits on polyamide filaments.
In E-Textiles 2019: International Conference on the Challenges, Opportunities, Innovations and Applications in Electronic Textiles.
MDPI..
(In Press)
Record type:
Conference or Workshop Item
(Paper)
Abstract
The weaving of flexible electronic filaments directly into the body of textiles during manufacture represents the state-of-the-art process for integrating electronic functionality into fabrics in a manner that obscures the presence of the electronics from the wearer. The reliability of emerging prototypes under typical stresses from washing and bending is primarily dependent on the durability of the electrical conductors, and their interconnections with the electronic components attached to them on polyimide filaments. To improve the durability of these filaments, this paper uses the classical beam theory to investigate the material characteristics (thickness and elastic modulus) and suitability of different encapsulations such as polyimide, polyurethane, mylar and peek films for limiting the mechanical stress on the electrical conductors.
Text
Preprint_version_Modelling_reliable_filament_conductors_for_e_textile_applications
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More information
Accepted/In Press date: 15 October 2019
Venue - Dates:
International Conference on the Challenges, Opportunities, Innovations and Applications in Electronic Textiles (E-TEXTILES 2019), , London, United Kingdom, 2019-11-12 - 2019-11-12
Identifiers
Local EPrints ID: 435776
URI: http://eprints.soton.ac.uk/id/eprint/435776
PURE UUID: 75f9781e-9f87-43ce-8028-2d829f26c9c6
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Date deposited: 20 Nov 2019 17:30
Last modified: 18 Apr 2024 01:45
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Contributors
Author:
Abiodun Komolafe
Author:
Russel Torah
Author:
Michael Tudor
Author:
Stephen Beeby
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