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Modelling reliable electrical conductors for e-textile circuits on polyamide filaments

Modelling reliable electrical conductors for e-textile circuits on polyamide filaments
Modelling reliable electrical conductors for e-textile circuits on polyamide filaments
The weaving of flexible electronic filaments directly into the body of textiles during manufacture represents the state-of-the-art process for integrating electronic functionality into fabrics in a manner that obscures the presence of the electronics from the wearer. The reliability of emerging prototypes under typical stresses from washing and bending is primarily dependent on the durability of the electrical conductors, and their interconnections with the electronic components attached to them on polyimide filaments. To improve the durability of these filaments, this paper uses the classical beam theory to investigate the material characteristics (thickness and elastic modulus) and suitability of different encapsulations such as polyimide, polyurethane, mylar and peek films for limiting the mechanical stress on the electrical conductors.
Multidisciplinary Digital Publishing Institute (MDPI)
Komolafe, Abiodun
5e79fbab-38be-4a64-94d5-867a94690932
Torah, Russel
7147b47b-db01-4124-95dc-90d6a9842688
Tudor, Michael
46eea408-2246-4aa0-8b44-86169ed601ff
Beeby, Stephen
ba565001-2812-4300-89f1-fe5a437ecb0d
Komolafe, Abiodun
5e79fbab-38be-4a64-94d5-867a94690932
Torah, Russel
7147b47b-db01-4124-95dc-90d6a9842688
Tudor, Michael
46eea408-2246-4aa0-8b44-86169ed601ff
Beeby, Stephen
ba565001-2812-4300-89f1-fe5a437ecb0d

Komolafe, Abiodun, Torah, Russel, Tudor, Michael and Beeby, Stephen (2019) Modelling reliable electrical conductors for e-textile circuits on polyamide filaments. In E-Textiles 2019: International Conference on the Challenges, Opportunities, Innovations and Applications in Electronic Textiles. Multidisciplinary Digital Publishing Institute (MDPI).. (In Press)

Record type: Conference or Workshop Item (Paper)

Abstract

The weaving of flexible electronic filaments directly into the body of textiles during manufacture represents the state-of-the-art process for integrating electronic functionality into fabrics in a manner that obscures the presence of the electronics from the wearer. The reliability of emerging prototypes under typical stresses from washing and bending is primarily dependent on the durability of the electrical conductors, and their interconnections with the electronic components attached to them on polyimide filaments. To improve the durability of these filaments, this paper uses the classical beam theory to investigate the material characteristics (thickness and elastic modulus) and suitability of different encapsulations such as polyimide, polyurethane, mylar and peek films for limiting the mechanical stress on the electrical conductors.

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Accepted/In Press date: 15 October 2019
Venue - Dates: International Conference on the Challenges, Opportunities, Innovations and Applications in Electronic Textiles (E-TEXTILES 2019), , London, United Kingdom, 2019-11-12 - 2019-11-12

Identifiers

Local EPrints ID: 435776
URI: http://eprints.soton.ac.uk/id/eprint/435776
PURE UUID: 75f9781e-9f87-43ce-8028-2d829f26c9c6
ORCID for Russel Torah: ORCID iD orcid.org/0000-0002-5598-2860
ORCID for Stephen Beeby: ORCID iD orcid.org/0000-0002-0800-1759

Catalogue record

Date deposited: 20 Nov 2019 17:30
Last modified: 18 Feb 2021 17:03

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Contributors

Author: Abiodun Komolafe
Author: Russel Torah ORCID iD
Author: Michael Tudor
Author: Stephen Beeby ORCID iD

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