Nanoprecision alignment for wafer bonding
Nanoprecision alignment for wafer bonding
High precision bonding alignment has been a key issue hindering the realization of many advanced semiconductor devices such as 3D ICs. With present optical means, micron-level alignment accuracy is obtained as the best results even from sophisticated commercial alignment machines. With the increasing demand on bonding alignment in the nanometer range, a mechanical passive alignment technique aiming at nanoprecision alignment for wafer bonding has been developed using kinematic and elastic averaging effects. The alignment features consisting of convex pyramids and concave pits have been fabricated and chip scale specimens have been successfully bonded after the microfabrication processes. An alignment precision of ?200nm has been achieved.
101-104
Jiang, Liudi
374f2414-51f0-418f-a316-e7db0d6dc4d1
Pandraud, G.
f9d14cad-3fe1-4e54-a397-87c218769501
French, P.J.
10c75469-53aa-449c-b8d6-9ef444b697b7
Spearing, S.M.
9e56a7b3-e0e8-47b1-a6b4-db676ed3c17a
Kraft, M.
54927621-738f-4d40-af56-a027f686b59f
2006
Jiang, Liudi
374f2414-51f0-418f-a316-e7db0d6dc4d1
Pandraud, G.
f9d14cad-3fe1-4e54-a397-87c218769501
French, P.J.
10c75469-53aa-449c-b8d6-9ef444b697b7
Spearing, S.M.
9e56a7b3-e0e8-47b1-a6b4-db676ed3c17a
Kraft, M.
54927621-738f-4d40-af56-a027f686b59f
Jiang, Liudi, Pandraud, G., French, P.J., Spearing, S.M. and Kraft, M.
(2006)
Nanoprecision alignment for wafer bonding.
17th workshop on Micromachining, Micromechanics and Microsystems, Southampton, Southampton, United Kingdom.
03 - 05 Sep 2006.
.
Record type:
Conference or Workshop Item
(Poster)
Abstract
High precision bonding alignment has been a key issue hindering the realization of many advanced semiconductor devices such as 3D ICs. With present optical means, micron-level alignment accuracy is obtained as the best results even from sophisticated commercial alignment machines. With the increasing demand on bonding alignment in the nanometer range, a mechanical passive alignment technique aiming at nanoprecision alignment for wafer bonding has been developed using kinematic and elastic averaging effects. The alignment features consisting of convex pyramids and concave pits have been fabricated and chip scale specimens have been successfully bonded after the microfabrication processes. An alignment precision of ?200nm has been achieved.
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Published date: 2006
Venue - Dates:
17th workshop on Micromachining, Micromechanics and Microsystems, Southampton, Southampton, United Kingdom, 2006-09-03 - 2006-09-05
Organisations:
Engineering Mats & Surface Engineerg Gp
Identifiers
Local EPrints ID: 43610
URI: http://eprints.soton.ac.uk/id/eprint/43610
PURE UUID: f2f3e33e-e590-4597-b228-72522919e06f
Catalogue record
Date deposited: 25 Jan 2007
Last modified: 05 Mar 2024 02:40
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Contributors
Author:
G. Pandraud
Author:
P.J. French
Author:
M. Kraft
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