Low cost infrared thermography for automated crack monitoring in fatigue testing
Low cost infrared thermography for automated crack monitoring in fatigue testing
The potential of using infrared thermography in the assessment of crack-tip parameters is described. The use of microbolometers is studied specifically to establish their suitability for use in thermoelastic stress analysis (TSA) for establishing the crack-tip parameters and for automatically monitoring crack growth using temperature measurement. To compare the behaviour of the two types of infrared cameras a camera model is devised, which is used to predict the thermoelastic response. A new automatic crack growth monitoring approach is developed based on the temperature measurement from the raw thermal data collected using the microbolometer. The thermoelastic response model and the crack monitoring procedure are demonstrated on 316L stainless steel single edge notch tension (SENT) specimens. Cracks were established in the specimens, grown and monitored using both types of infrared detector. The procedure is validated using measurements from the photon detector and it is shown that accurate stress intensity factors (SIFs) can be obtained from growing cracks using directly the live readings from the microbolometer. The procedure provides a new means for non-contact measurements in fatigue testing, establishing crack growth rate and the SIFs with the potential for actuator control.
Camera models, Crack monitoring, Infrared thermography, Thermoelastic stress analysis
Thatcher, J.E.
2600b694-6693-4c57-8bf3-1fcafd84e04c
Crump, D.A.
5fa2d636-89bc-4005-a948-32554ef3d951
Devivier, C.
2b61a795-6411-4df7-b175-c55920487d86
Bailey, P.B.S.
a3c7ed6c-043b-4d94-970a-01f3b0f5016d
Dulieu-Barton, J.M.
9e35bebb-2185-4d16-a1bc-bb8f20e06632
1 March 2020
Thatcher, J.E.
2600b694-6693-4c57-8bf3-1fcafd84e04c
Crump, D.A.
5fa2d636-89bc-4005-a948-32554ef3d951
Devivier, C.
2b61a795-6411-4df7-b175-c55920487d86
Bailey, P.B.S.
a3c7ed6c-043b-4d94-970a-01f3b0f5016d
Dulieu-Barton, J.M.
9e35bebb-2185-4d16-a1bc-bb8f20e06632
Thatcher, J.E., Crump, D.A., Devivier, C., Bailey, P.B.S. and Dulieu-Barton, J.M.
(2020)
Low cost infrared thermography for automated crack monitoring in fatigue testing.
Optics and Lasers in Engineering, 126, [105914].
(doi:10.1016/j.optlaseng.2019.105914).
Abstract
The potential of using infrared thermography in the assessment of crack-tip parameters is described. The use of microbolometers is studied specifically to establish their suitability for use in thermoelastic stress analysis (TSA) for establishing the crack-tip parameters and for automatically monitoring crack growth using temperature measurement. To compare the behaviour of the two types of infrared cameras a camera model is devised, which is used to predict the thermoelastic response. A new automatic crack growth monitoring approach is developed based on the temperature measurement from the raw thermal data collected using the microbolometer. The thermoelastic response model and the crack monitoring procedure are demonstrated on 316L stainless steel single edge notch tension (SENT) specimens. Cracks were established in the specimens, grown and monitored using both types of infrared detector. The procedure is validated using measurements from the photon detector and it is shown that accurate stress intensity factors (SIFs) can be obtained from growing cracks using directly the live readings from the microbolometer. The procedure provides a new means for non-contact measurements in fatigue testing, establishing crack growth rate and the SIFs with the potential for actuator control.
Text
OLEN 2020 _ Thatcher et al
- Accepted Manuscript
More information
Accepted/In Press date: 21 October 2019
e-pub ahead of print date: 6 November 2019
Published date: 1 March 2020
Keywords:
Camera models, Crack monitoring, Infrared thermography, Thermoelastic stress analysis
Identifiers
Local EPrints ID: 436282
URI: http://eprints.soton.ac.uk/id/eprint/436282
ISSN: 0143-8166
PURE UUID: 06f63537-3b8e-487a-8668-cc10e9bd764e
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Date deposited: 05 Dec 2019 17:30
Last modified: 17 Mar 2024 05:03
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Contributors
Author:
J.E. Thatcher
Author:
D.A. Crump
Author:
C. Devivier
Author:
P.B.S. Bailey
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