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On Runtime Communication and Thermal-Aware Application Mapping and Defragmentation in 3D NoC Systems

On Runtime Communication and Thermal-Aware Application Mapping and Defragmentation in 3D NoC Systems
On Runtime Communication and Thermal-Aware Application Mapping and Defragmentation in 3D NoC Systems

Many-core systems connected by 3D Networks-on-Chip (NoC) are emerging as a promising computation engine for systems like cloud computing servers, big data systems, etc. Mapping applications at runtime to 3D NoCs is the key to maintain high throughput of the overall chip under a thermal/power constraint. However, the goals of optimizing both the communication latency and chip peak temperature are contradicting due to several reasons. First, exploiting the vertical TSV links can accelerate communications, while low peak temperature prefers that the tasks to be mapped closer to the heat sink, instead of using the vertical links. Second, mapping tasks in close proximity can reduce communication latency, but at the cost of poor heat dissipation. To address these issues, in this paper, we propose an efficient runtime mapping algorithm to reduce both communication latency and overall application running time under thermal constraint. In essence, this algorithm first selects a 3D cuboid core region of a specific shape for each incoming application by setting the region's number of occupied vertical layers and its distance to the heat sink, in order to optimize its communication performance and peak temperature. Next, the exact locations of the core regions in the chip are determined, followed by a task-to-core mapping. A defragmentation algorithm is also proposed to keep free core regions contiguous. The experimental results have confirmed that, compared to two recently proposed runtime mapping algorithms, our proposed approach can reduce the total running time by up to 48% and communication cost by up to 44%, with a low runtime overhead.

3D NoC, application mapping, defragmentation, thermal management
1045-9219
2775-2789
Li, Bing
402384d8-5300-44f9-bdbe-202be532b3bd
Wang, Xiaohang
95ffd2f0-3e1f-4cbe-8067-b600d6a08f75
Singh, Amit Kumar
bb67d43e-34d9-4b58-9295-8b5458270408
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53
Li, Bing
402384d8-5300-44f9-bdbe-202be532b3bd
Wang, Xiaohang
95ffd2f0-3e1f-4cbe-8067-b600d6a08f75
Singh, Amit Kumar
bb67d43e-34d9-4b58-9295-8b5458270408
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53

Li, Bing, Wang, Xiaohang, Singh, Amit Kumar and Mak, Terrence (2019) On Runtime Communication and Thermal-Aware Application Mapping and Defragmentation in 3D NoC Systems. IEEE Transactions on Parallel and Distributed Systems, 30 (12), 2775-2789, [8733089]. (doi:10.1109/TPDS.2019.2921542).

Record type: Article

Abstract

Many-core systems connected by 3D Networks-on-Chip (NoC) are emerging as a promising computation engine for systems like cloud computing servers, big data systems, etc. Mapping applications at runtime to 3D NoCs is the key to maintain high throughput of the overall chip under a thermal/power constraint. However, the goals of optimizing both the communication latency and chip peak temperature are contradicting due to several reasons. First, exploiting the vertical TSV links can accelerate communications, while low peak temperature prefers that the tasks to be mapped closer to the heat sink, instead of using the vertical links. Second, mapping tasks in close proximity can reduce communication latency, but at the cost of poor heat dissipation. To address these issues, in this paper, we propose an efficient runtime mapping algorithm to reduce both communication latency and overall application running time under thermal constraint. In essence, this algorithm first selects a 3D cuboid core region of a specific shape for each incoming application by setting the region's number of occupied vertical layers and its distance to the heat sink, in order to optimize its communication performance and peak temperature. Next, the exact locations of the core regions in the chip are determined, followed by a task-to-core mapping. A defragmentation algorithm is also proposed to keep free core regions contiguous. The experimental results have confirmed that, compared to two recently proposed runtime mapping algorithms, our proposed approach can reduce the total running time by up to 48% and communication cost by up to 44%, with a low runtime overhead.

Full text not available from this repository.

More information

Accepted/In Press date: 27 May 2019
e-pub ahead of print date: 7 June 2019
Published date: 1 December 2019
Keywords: 3D NoC, application mapping, defragmentation, thermal management

Identifiers

Local EPrints ID: 436293
URI: http://eprints.soton.ac.uk/id/eprint/436293
ISSN: 1045-9219
PURE UUID: c1b356e8-6542-4c5c-9482-4905402dfb16

Catalogue record

Date deposited: 06 Dec 2019 17:30
Last modified: 07 Oct 2020 00:25

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