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Effect of spark plasma sintering and high-pressure torsion on the microstructural and mechanical properties of a Cu–SiC composite

Effect of spark plasma sintering and high-pressure torsion on the microstructural and mechanical properties of a Cu–SiC composite
Effect of spark plasma sintering and high-pressure torsion on the microstructural and mechanical properties of a Cu–SiC composite

This investigation examines the problem of homogenization in metal matrix composites (MMCs) and the methods of increasing their strength using severe plastic deformation (SPD). In this research MMCs of pure copper and silicon carbide were synthesized by spark plasma sintering (SPS) and then further processed via high-pressure torsion (HPT). The microstructures in the sintered and in the deformed materials were investigated using Scanning Electron Microscopy (SEM) and Scanning Transmission Electron Microscopy (STEM). The mechanical properties were evaluated in microhardness tests and in tensile testing. The thermal conductivity of the composites was measured with the use of a laser pulse technique. Microstructural analysis revealed that HPT processing leads to an improved densification of the SPS-produced composites with significant grain refinement in the copper matrix and with fragmentation of the SiC particles and their homogeneous distribution in the copper matrix. The HPT processing of Cu and the Cu–SiC samples enhanced their mechanical properties at the expense of limiting their plasticity. Processing by HPT also had a major influence on the thermal conductivity of materials. It is demonstrated that the deformed samples exhibit higher thermal conductivity than the initial coarse-grained samples.

Copper, High-pressure torsion, Silicon carbide, Spark plasma sintering, Thermal conductivity
0921-5093
Bazarnik, P.
7612d50d-0cfc-43b1-a48f-f5062caacc1e
Nosewicz, S.
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Romelczyk-Baishya, B.
8b5a8510-b1c5-40ab-b004-acd001ac6074
Chmielewski, M.
782489cc-1ca9-4374-af9e-b5e491622440
Strojny Nędza, A.
60679776-550c-4b4a-b2d3-a1302589c2a7
Maj, J.
c6e0e3fe-02c4-4eb5-8c41-69ed342857a1
Huang, Y.
9f4df815-51c1-4ee8-ad63-a92bf997103e
Lewandowska, M.
c574d02d-d34d-4164-8ed1-90c3d77584d2
Langdon, T. G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86
Bazarnik, P.
7612d50d-0cfc-43b1-a48f-f5062caacc1e
Nosewicz, S.
7e211113-c3ee-4bab-b7f6-4710b03ed3fc
Romelczyk-Baishya, B.
8b5a8510-b1c5-40ab-b004-acd001ac6074
Chmielewski, M.
782489cc-1ca9-4374-af9e-b5e491622440
Strojny Nędza, A.
60679776-550c-4b4a-b2d3-a1302589c2a7
Maj, J.
c6e0e3fe-02c4-4eb5-8c41-69ed342857a1
Huang, Y.
9f4df815-51c1-4ee8-ad63-a92bf997103e
Lewandowska, M.
c574d02d-d34d-4164-8ed1-90c3d77584d2
Langdon, T. G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86

Bazarnik, P., Nosewicz, S., Romelczyk-Baishya, B., Chmielewski, M., Strojny Nędza, A., Maj, J., Huang, Y., Lewandowska, M. and Langdon, T. G. (2019) Effect of spark plasma sintering and high-pressure torsion on the microstructural and mechanical properties of a Cu–SiC composite. Materials Science And Engineering A, 766, [138350]. (doi:10.1016/j.msea.2019.138350).

Record type: Article

Abstract

This investigation examines the problem of homogenization in metal matrix composites (MMCs) and the methods of increasing their strength using severe plastic deformation (SPD). In this research MMCs of pure copper and silicon carbide were synthesized by spark plasma sintering (SPS) and then further processed via high-pressure torsion (HPT). The microstructures in the sintered and in the deformed materials were investigated using Scanning Electron Microscopy (SEM) and Scanning Transmission Electron Microscopy (STEM). The mechanical properties were evaluated in microhardness tests and in tensile testing. The thermal conductivity of the composites was measured with the use of a laser pulse technique. Microstructural analysis revealed that HPT processing leads to an improved densification of the SPS-produced composites with significant grain refinement in the copper matrix and with fragmentation of the SiC particles and their homogeneous distribution in the copper matrix. The HPT processing of Cu and the Cu–SiC samples enhanced their mechanical properties at the expense of limiting their plasticity. Processing by HPT also had a major influence on the thermal conductivity of materials. It is demonstrated that the deformed samples exhibit higher thermal conductivity than the initial coarse-grained samples.

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Accepted/In Press date: 27 August 2019
e-pub ahead of print date: 28 August 2019
Published date: 24 October 2019
Keywords: Copper, High-pressure torsion, Silicon carbide, Spark plasma sintering, Thermal conductivity

Identifiers

Local EPrints ID: 437353
URI: http://eprints.soton.ac.uk/id/eprint/437353
ISSN: 0921-5093
PURE UUID: 024ed1ee-f56d-41a6-ac57-c01b1cff586d
ORCID for Y. Huang: ORCID iD orcid.org/0000-0001-9259-8123
ORCID for T. G. Langdon: ORCID iD orcid.org/0000-0003-3541-9250

Catalogue record

Date deposited: 24 Jan 2020 17:32
Last modified: 07 Oct 2020 06:44

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Contributors

Author: P. Bazarnik
Author: S. Nosewicz
Author: B. Romelczyk-Baishya
Author: M. Chmielewski
Author: A. Strojny Nędza
Author: J. Maj
Author: Y. Huang ORCID iD
Author: M. Lewandowska
Author: T. G. Langdon ORCID iD

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