Adhesion lithography for fabrication of printed radio-frequency diodes

Georgiadou, Dimitra G., Semple, James and Anthopoulos, Thomas D. (2017) Adhesion lithography for fabrication of printed radio-frequency diodes. SPIE Newsroom. (doi:10.1117/2.1201611.006783).

Record type: Article

Abstract

Radio-frequency (RF) diodes are quintessential elements of passive RF identification tags that are used on livestock, luxury objects, and healthcare products. They are also used in near-field communication applications that enable wireless data transfer between devices. An RF diode—when matched to a suitable antenna—picks up the alternating current (AC) signal that is emitted from an RF source and transforms it to a DC signal. The DC signal can then be used to decode the information stored in the tagged object, or to simply power another electronic or optoelectronic device (e.g., a sensor, battery, or LED). The high demand for RF-harvesting devices, however, can only fully be met if their fabrication costs are substantially reduced. To realize this reduction in cost, novel printing technologies that permit manufacturing on large substrates are required. With these technologies it should be possible to ascertain that an increased diode performance (in terms of a small voltage drop, minimum leakage current, and a large gamut of operating frequencies) is attained.

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