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Deep ultraviolet copper(I) thiocyanate (CuSCN) photodetectors based on coplanar nanogap electrodes fabricated via adhesion lithography

Deep ultraviolet copper(I) thiocyanate (CuSCN) photodetectors based on coplanar nanogap electrodes fabricated via adhesion lithography
Deep ultraviolet copper(I) thiocyanate (CuSCN) photodetectors based on coplanar nanogap electrodes fabricated via adhesion lithography

Adhesion lithography (a-Lith) is a versatile fabrication technique used to produce asymmetric coplanar electrodes separated by a <15 nm nanogap. Here, we use a-Lith to fabricate deep ultraviolet (DUV) photodetectors by combining coplanar asymmetric nanogap electrode architectures (Au/Al) with solution-processable wide-band-gap (3.5-3.9 eV) p-type semiconductor copper(I) thiocyanate (CuSCN). Because of the device's unique architecture, the detectors exhibit high responsivity (≈79 A W-1) and photosensitivity (≈720) when illuminated with a DUV-range (peak = 280 nm) light-emitting diode at 220 μW cm-2. Interestingly, the photosensitivity of the photodetectors remains fairly high (≈7) even at illuminating intensities down to 0.2 μW cm-2. The scalability of the a-Lith process combined with the unique properties of CuSCN paves the way to new forms of inexpensive, yet high-performance, photodetectors that can be manufactured on arbitrary substrate materials including plastic.

coplanar electrodes, photodiode, photosensitivity, responsivity, solution-processed
1944-8244
41965-41972
Wyatt-Moon, Gwenhivir
f332707a-2026-406a-b32e-2a29d9cf6423
Georgiadou, Dimitra G.
84977176-3678-4fb3-a3dd-2044a49c853b
Semple, James
44fd17bf-5f7c-4e73-91c1-65be28b1c881
Anthopoulos, Thomas D.
d6ee9390-d991-4277-a721-030f22d614c9
Wyatt-Moon, Gwenhivir
f332707a-2026-406a-b32e-2a29d9cf6423
Georgiadou, Dimitra G.
84977176-3678-4fb3-a3dd-2044a49c853b
Semple, James
44fd17bf-5f7c-4e73-91c1-65be28b1c881
Anthopoulos, Thomas D.
d6ee9390-d991-4277-a721-030f22d614c9

Wyatt-Moon, Gwenhivir, Georgiadou, Dimitra G., Semple, James and Anthopoulos, Thomas D. (2017) Deep ultraviolet copper(I) thiocyanate (CuSCN) photodetectors based on coplanar nanogap electrodes fabricated via adhesion lithography. ACS Applied Materials and Interfaces, 9 (48), 41965-41972. (doi:10.1021/acsami.7b12942).

Record type: Article

Abstract

Adhesion lithography (a-Lith) is a versatile fabrication technique used to produce asymmetric coplanar electrodes separated by a <15 nm nanogap. Here, we use a-Lith to fabricate deep ultraviolet (DUV) photodetectors by combining coplanar asymmetric nanogap electrode architectures (Au/Al) with solution-processable wide-band-gap (3.5-3.9 eV) p-type semiconductor copper(I) thiocyanate (CuSCN). Because of the device's unique architecture, the detectors exhibit high responsivity (≈79 A W-1) and photosensitivity (≈720) when illuminated with a DUV-range (peak = 280 nm) light-emitting diode at 220 μW cm-2. Interestingly, the photosensitivity of the photodetectors remains fairly high (≈7) even at illuminating intensities down to 0.2 μW cm-2. The scalability of the a-Lith process combined with the unique properties of CuSCN paves the way to new forms of inexpensive, yet high-performance, photodetectors that can be manufactured on arbitrary substrate materials including plastic.

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More information

Published date: 27 November 2017
Keywords: coplanar electrodes, photodiode, photosensitivity, responsivity, solution-processed

Identifiers

Local EPrints ID: 440528
URI: http://eprints.soton.ac.uk/id/eprint/440528
ISSN: 1944-8244
PURE UUID: 421de157-f371-4d9d-b0bf-275a0c856b52
ORCID for Dimitra G. Georgiadou: ORCID iD orcid.org/0000-0002-2620-3346

Catalogue record

Date deposited: 06 May 2020 16:31
Last modified: 07 Oct 2020 02:27

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Contributors

Author: Gwenhivir Wyatt-Moon
Author: James Semple
Author: Thomas D. Anthopoulos

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