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Silicon photonics: some remaining challenges

Silicon photonics: some remaining challenges
Silicon photonics: some remaining challenges
This paper discusses some of the remaining challenges for silicon photonics, and how we at Southampton University have approached some of them. Despite phenomenal advances in the field of Silicon Photonics, there are a number of areas that still require development. For short to medium reach applications, there is a need to improve the power consumption of photonic circuits such that inter-chip, and perhaps intra-chip applications are viable. This means that yet smaller devices are required as well as thermally stable devices, and multiple wavelength channels. In turn this demands smaller, more efficient modulators, athermal circuits, and improved wavelength division multiplexers. The debate continues as to whether on-chip lasers are necessary for all applications, but an efficient low cost laser would benefit many applications. Multi-layer photonics offers the possibility of increasing the complexity and effectiveness of a given area of chip real estate, but it is a demanding challenge. Low cost packaging (in particular, passive alignment of fibre to waveguide), and effective wafer scale testing strategies, are also essential for mass market applications. Whilst solutions to these challenges would enhance most applications, a derivative technology is emerging, that of Mid Infra-Red (MIR) silicon photonics. This field will build on existing developments, but will require key enhancements to facilitate functionality at longer wavelengths. In common with mainstream silicon photonics, significant developments have been made, but there is still much left to do. Here we summarise some of our recent work towards wafer scale testing, passive alignment, multiplexing, and MIR silicon photonics technology.
0277-786X
Topley, R.
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Khokhar, A.Z.
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Thompson, D.J.
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Stanković, S.
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Reynolds, S.
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Chen, Xiao
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Soper, N.
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Mitchell, C.J.
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Hu, Y.
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Shen, L.
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Martinez-Jimenez, G.
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Healy, N.
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Nedeljković, M.
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Gardes, F.Y.
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Soler Penadés, J.
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Alonso-Ramos, C.
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Wangüemert-Pérez, G.
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Molina-Fernández, I.
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Cheben, P.
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Mashanovich, G.Z.
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Topley, R.
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Khokhar, A.Z.
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Stanković, S.
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Reynolds, S.
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Chen, Xiao
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Soper, N.
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Mitchell, C.J.
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Hu, Y.
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Shen, L.
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Martinez-Jimenez, G.
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Healy, N.
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Mailis, S.
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Ortega-Moñux, A.
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Wangüemert-Pérez, G.
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Molina-Fernández, I.
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Cheben, P.
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Topley, R., Khokhar, A.Z., Thompson, D.J., Stanković, S., Reynolds, S., Chen, Xiao, Soper, N., Mitchell, C.J., Hu, Y., Shen, L., Martinez-Jimenez, G., Healy, N., Mailis, S., Peacock, A.C., Nedeljković, M., Gardes, F.Y., Soler Penadés, J., Alonso-Ramos, C., Ortega-Moñux, A., Wangüemert-Pérez, G., Molina-Fernández, I., Cheben, P. and Mashanovich, G.Z. (2016) Silicon photonics: some remaining challenges. Proceedings of SPIE, 9751. (doi:10.1117/12.2218124).

Record type: Article

Abstract

This paper discusses some of the remaining challenges for silicon photonics, and how we at Southampton University have approached some of them. Despite phenomenal advances in the field of Silicon Photonics, there are a number of areas that still require development. For short to medium reach applications, there is a need to improve the power consumption of photonic circuits such that inter-chip, and perhaps intra-chip applications are viable. This means that yet smaller devices are required as well as thermally stable devices, and multiple wavelength channels. In turn this demands smaller, more efficient modulators, athermal circuits, and improved wavelength division multiplexers. The debate continues as to whether on-chip lasers are necessary for all applications, but an efficient low cost laser would benefit many applications. Multi-layer photonics offers the possibility of increasing the complexity and effectiveness of a given area of chip real estate, but it is a demanding challenge. Low cost packaging (in particular, passive alignment of fibre to waveguide), and effective wafer scale testing strategies, are also essential for mass market applications. Whilst solutions to these challenges would enhance most applications, a derivative technology is emerging, that of Mid Infra-Red (MIR) silicon photonics. This field will build on existing developments, but will require key enhancements to facilitate functionality at longer wavelengths. In common with mainstream silicon photonics, significant developments have been made, but there is still much left to do. Here we summarise some of our recent work towards wafer scale testing, passive alignment, multiplexing, and MIR silicon photonics technology.

Full text not available from this repository.

More information

Published date: 13 February 2016
Additional Information: SPIE Opto 9751
Venue - Dates: Photonics West 2016, United States, 2016-02-13 - 2016-02-18

Identifiers

Local EPrints ID: 442558
URI: http://eprints.soton.ac.uk/id/eprint/442558
ISSN: 0277-786X
PURE UUID: 3b141a41-3a69-4c29-b9bb-b51962a0264a
ORCID for S. Stanković: ORCID iD orcid.org/0000-0001-6154-3138
ORCID for C.J. Mitchell: ORCID iD orcid.org/0000-0001-9773-8842
ORCID for S. Mailis: ORCID iD orcid.org/0000-0001-8100-2670
ORCID for A.C. Peacock: ORCID iD orcid.org/0000-0002-1940-7172
ORCID for M. Nedeljković: ORCID iD orcid.org/0000-0002-9170-7911
ORCID for J. Soler Penadés: ORCID iD orcid.org/0000-0002-1706-8533

Catalogue record

Date deposited: 20 Jul 2020 16:30
Last modified: 18 Feb 2021 17:23

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Contributors

Author: R. Topley
Author: A.Z. Khokhar
Author: D.J. Thompson
Author: S. Stanković ORCID iD
Author: S. Reynolds
Author: Xiao Chen
Author: N. Soper
Author: C.J. Mitchell ORCID iD
Author: Y. Hu
Author: L. Shen
Author: G. Martinez-Jimenez
Author: N. Healy
Author: S. Mailis ORCID iD
Author: A.C. Peacock ORCID iD
Author: M. Nedeljković ORCID iD
Author: F.Y. Gardes
Author: J. Soler Penadés ORCID iD
Author: C. Alonso-Ramos
Author: A. Ortega-Moñux
Author: G. Wangüemert-Pérez
Author: I. Molina-Fernández
Author: P. Cheben

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