Integration of CMOS front-end circuits with silicon photonic devices for high speed PAM-4 optical links
Integration of CMOS front-end circuits with silicon photonic devices for high speed PAM-4 optical links
This paper presents our recent studies on CMOS front-end circuits for high speed optical links. The circuit topologies of both transimpedance amplifier (TIA) and modulator driver (MD) are discussed for achieving wideband operation in PAM-4 modulation using advanced CMOS technology. Also, issues of integration of the circuits with silicon photonic devices such as the Ge-on-Si photo diode (PD) and silicon modulator are addressed for high performance silicon-based transceiver front-end of optical link.
Hsu, Shawn S.H.
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Li, Yan-Feng
c5394fc2-dbaa-4757-bdc1-4a769bf3bf90
Wang, Hao-Ju
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Chen, Tai-Chun
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Tseng, Chih-Kuo
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Lee, M.
a32632b8-9332-4150-998c-64e0c3fb5d8c
Li, Ke
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Thomson, David J.
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Reed, Graham T.
ca08dd60-c072-4d7d-b254-75714d570139
2017
Hsu, Shawn S.H.
fd3d085e-4846-45bd-9701-06159968634e
Li, Yan-Feng
c5394fc2-dbaa-4757-bdc1-4a769bf3bf90
Wang, Hao-Ju
7d21d569-cb25-41bb-8a9e-e4bb1c50946f
Chen, Tai-Chun
0bc92a83-1a90-42de-8421-beed2609bc16
Tseng, Chih-Kuo
62bd24c5-ec6b-44ac-8bed-cec46d9a894b
Lee, M.
a32632b8-9332-4150-998c-64e0c3fb5d8c
Li, Ke
dd788ca7-0a39-4364-b4b8-65f0bb93340f
Thomson, David J.
17c1626c-2422-42c6-98e0-586ae220bcda
Reed, Graham T.
ca08dd60-c072-4d7d-b254-75714d570139
Hsu, Shawn S.H., Li, Yan-Feng, Wang, Hao-Ju, Chen, Tai-Chun, Tseng, Chih-Kuo, Lee, M., Li, Ke, Thomson, David J. and Reed, Graham T.
(2017)
Integration of CMOS front-end circuits with silicon photonic devices for high speed PAM-4 optical links.
In 2017 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT).
IEEE..
(doi:10.1109/RFIT.2017.8048241).
Record type:
Conference or Workshop Item
(Paper)
Abstract
This paper presents our recent studies on CMOS front-end circuits for high speed optical links. The circuit topologies of both transimpedance amplifier (TIA) and modulator driver (MD) are discussed for achieving wideband operation in PAM-4 modulation using advanced CMOS technology. Also, issues of integration of the circuits with silicon photonic devices such as the Ge-on-Si photo diode (PD) and silicon modulator are addressed for high performance silicon-based transceiver front-end of optical link.
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Published date: 2017
Venue - Dates:
IEEE International Symposium on Radio-Frequency Integration Technology (RFIT), , Seoul, South Korea, 2017-08-30 - 2017-09-01
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Local EPrints ID: 442727
URI: http://eprints.soton.ac.uk/id/eprint/442727
PURE UUID: 410e3b82-3f79-4830-83d2-3d3485e9c01b
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Date deposited: 24 Jul 2020 16:30
Last modified: 16 Mar 2024 08:45
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Contributors
Author:
Shawn S.H. Hsu
Author:
Yan-Feng Li
Author:
Hao-Ju Wang
Author:
Tai-Chun Chen
Author:
Chih-Kuo Tseng
Author:
M. Lee
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