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Random vibration response prediction of electronic device based on hierarchicaly model updating and validation

Random vibration response prediction of electronic device based on hierarchicaly model updating and validation
Random vibration response prediction of electronic device based on hierarchicaly model updating and validation
Electronic device is susceptible to failure due to environmental vibration during transportation and use, even causing the entire device to failure. In recent years, the structure of electronic device has been more complex, the application range has become more and more extensive, and requirements for structural performance under vibration environment of electronic device are more strict, especially in the aviation and aerospace field. Therefore, in order to ensure the safe and reliable work of electronic device, and to control vibration level effectively , it is necessary to carry out environmental vibration simulation analysis and response prediction for electronic device.
In this paper, a certain type of aviation airborne electronic device is taken as the research object. The finite element method is used to model the electronic device. In order to obtain an accurate finite element model to simulate the vibration of the electronic device, the hierarchicaly model updating and validation is applied to the vibration simulation for the electronic device. Then the substructure FE model (PCB printed circuit board without electronic items) is firstly calibrated by means of the deterministic model updating technique by comparing with the experiment modal analysis. And a Bayesian method of parameter uncertainty quantification was employed to identify the mass and stiffness distribution (PCB with electronic items). Finally, the established validated model is used to predict the random response of the reference points and verified by random vibration test.
Electronic device; finite element model updating; stuctural dynamics; random vibration; response prediction
Jiang, Tengteng
14e6427f-12d5-414a-9663-80c7add446e3
Guo, Qintao
5070ec48-bfca-4da7-87bd-d9df3fc9eb63
Xiong, Yeping
51be8714-186e-4d2f-8e03-f44c428a4a49
Ma, Hui
43306280-9534-4be5-aa66-468692110a0a
Jiang, Tengteng
14e6427f-12d5-414a-9663-80c7add446e3
Guo, Qintao
5070ec48-bfca-4da7-87bd-d9df3fc9eb63
Xiong, Yeping
51be8714-186e-4d2f-8e03-f44c428a4a49
Ma, Hui
43306280-9534-4be5-aa66-468692110a0a

Jiang, Tengteng, Guo, Qintao, Xiong, Yeping and Ma, Hui (2020) Random vibration response prediction of electronic device based on hierarchicaly model updating and validation. In Fluid Structure Interactions Group. (In Press)

Record type: Conference or Workshop Item (Paper)

Abstract

Electronic device is susceptible to failure due to environmental vibration during transportation and use, even causing the entire device to failure. In recent years, the structure of electronic device has been more complex, the application range has become more and more extensive, and requirements for structural performance under vibration environment of electronic device are more strict, especially in the aviation and aerospace field. Therefore, in order to ensure the safe and reliable work of electronic device, and to control vibration level effectively , it is necessary to carry out environmental vibration simulation analysis and response prediction for electronic device.
In this paper, a certain type of aviation airborne electronic device is taken as the research object. The finite element method is used to model the electronic device. In order to obtain an accurate finite element model to simulate the vibration of the electronic device, the hierarchicaly model updating and validation is applied to the vibration simulation for the electronic device. Then the substructure FE model (PCB printed circuit board without electronic items) is firstly calibrated by means of the deterministic model updating technique by comparing with the experiment modal analysis. And a Bayesian method of parameter uncertainty quantification was employed to identify the mass and stiffness distribution (PCB with electronic items). Finally, the established validated model is used to predict the random response of the reference points and verified by random vibration test.

Full text not available from this repository.

More information

Accepted/In Press date: 26 July 2020
Venue - Dates: 2020 CSAA/IET International Conference on Aircraft Utility Systems, , Tianjin, China, 2020-09-18 - 2020-09-21
Keywords: Electronic device; finite element model updating; stuctural dynamics; random vibration; response prediction

Identifiers

Local EPrints ID: 442877
URI: http://eprints.soton.ac.uk/id/eprint/442877
PURE UUID: 7464c59f-1ca1-46ee-9c7e-ba716c5d149a
ORCID for Yeping Xiong: ORCID iD orcid.org/0000-0002-0135-8464

Catalogue record

Date deposited: 30 Jul 2020 16:30
Last modified: 18 Feb 2021 16:55

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Contributors

Author: Tengteng Jiang
Author: Qintao Guo
Author: Yeping Xiong ORCID iD
Author: Hui Ma

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