Random vibration response prediction of electronic device based on hierarchicaly model updating and validation

Jiang, Tengteng, Guo, Qintao, Xiong, Yeping and Ma, Hui (2020) Random vibration response prediction of electronic device based on hierarchicaly model updating and validation. In Fluid Structure Interactions Group. (In Press)

Abstract

Electronic device is susceptible to failure due to environmental vibration during transportation and use, even causing the entire device to failure. In recent years, the structure of electronic device has been more complex, the application range has become more and more extensive, and requirements for structural performance under vibration environment of electronic device are more strict, especially in the aviation and aerospace field. Therefore, in order to ensure the safe and reliable work of electronic device, and to control vibration level effectively , it is necessary to carry out environmental vibration simulation analysis and response prediction for electronic device.
In this paper, a certain type of aviation airborne electronic device is taken as the research object. The finite element method is used to model the electronic device. In order to obtain an accurate finite element model to simulate the vibration of the electronic device, the hierarchicaly model updating and validation is applied to the vibration simulation for the electronic device. Then the substructure FE model (PCB printed circuit board without electronic items) is firstly calibrated by means of the deterministic model updating technique by comparing with the experiment modal analysis. And a Bayesian method of parameter uncertainty quantification was employed to identify the mass and stiffness distribution (PCB with electronic items). Finally, the established validated model is used to predict the random response of the reference points and verified by random vibration test.

This record has no associated files available for download.

Contributors

Author: Yeping Xiong

Download statistics