Dataset for: Tooling and procedures for hybrid integration of lasers by flip-chip technology
Dataset for: Tooling and procedures for hybrid integration of lasers by flip-chip technology
Dataset to support conference paper : Mitchell, C. et al. (2020). Tooling and procedures for hybrid integration of lasers by flip-chip technology. Paper presented at Electronics System-Integration Technology Conference 2020, Vestfold, Norway.
laser integration, silicon photonics, hybrid integration, flip-chip, passive alignmnet
University of Southampton
Mitchell, Colin
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Schachler, Ralph
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Li, Ke
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Khokhar, Ali Z
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Chen, Xia
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Stankovic, Stevan
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Sessions, Neil
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Grabska, Katarzyna
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Wang, Xiangjun
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Thomson, David
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Daedlow, Christoph
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Reed, Graham
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Wilkinson, James S
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Mitchell, Colin
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Schachler, Ralph
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Li, Ke
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Khokhar, Ali Z
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Chen, Xia
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Stankovic, Stevan
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Sessions, Neil
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Grabska, Katarzyna
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Wang, Xiangjun
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Thomson, David
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Daedlow, Christoph
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Reed, Graham
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Wilkinson, James S
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