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Tooling and procedures for hybrid integration of lasers by flip-chip technology

Tooling and procedures for hybrid integration of lasers by flip-chip technology
Tooling and procedures for hybrid integration of lasers by flip-chip technology
A method of achieving hybrid integration of laser bars on a silicon platform, using chip-flip bonding, is presented. A support structure etched into the substrate is used to provide vertical alignment to the plane utilizing a gimballed placement laser tool. In-plane accuracy is provided by bonder tolerances, with facet-to-facet alignment enabled by high magnification optics and the dimensions of the laser bar. Chip design features have increased allowed tolerances during fabrication of the support structure giving a route to higher yield in manufacture.
IEEE
Mitchell, Colin
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Schachler, Ralph
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Li, Ke
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Khokhar, Ali Z
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Chen, Xia
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Stanković, Stevan
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Sessions, Neil
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Grabska, Katarzyna
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Wang, Xiangjun
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Thomson, David
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Daedlow, Christoph
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Reed, Graham
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Wilkinson, James S
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Mitchell, Colin
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Schachler, Ralph
8c2a398e-0fed-44bf-be28-a7b52c7a63e1
Li, Ke
dd788ca7-0a39-4364-b4b8-65f0bb93340f
Khokhar, Ali Z
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Chen, Xia
64f6ab92-ca11-4489-8c03-52bc986209ae
Stanković, Stevan
13e8c464-b876-405a-b442-7c437a6eafd3
Sessions, Neil
ee737092-56b4-403e-a2f9-764e07e42625
Grabska, Katarzyna
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Wang, Xiangjun
07a972f2-d0cd-4138-a11c-181bbc4a343e
Thomson, David
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Daedlow, Christoph
23b4a3ca-a0ad-4430-a116-40c06cd20fbe
Reed, Graham
ca08dd60-c072-4d7d-b254-75714d570139
Wilkinson, James S
73483cf3-d9f2-4688-9b09-1c84257884ca

Mitchell, Colin, Schachler, Ralph, Li, Ke, Khokhar, Ali Z, Chen, Xia, Stanković, Stevan, Sessions, Neil, Grabska, Katarzyna, Wang, Xiangjun, Thomson, David, Daedlow, Christoph, Reed, Graham and Wilkinson, James S (2020) Tooling and procedures for hybrid integration of lasers by flip-chip technology. In Proceedings of the 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE. 7 pp . (doi:10.1109/estc48849.2020.9229661).

Record type: Conference or Workshop Item (Paper)

Abstract

A method of achieving hybrid integration of laser bars on a silicon platform, using chip-flip bonding, is presented. A support structure etched into the substrate is used to provide vertical alignment to the plane utilizing a gimballed placement laser tool. In-plane accuracy is provided by bonder tolerances, with facet-to-facet alignment enabled by high magnification optics and the dimensions of the laser bar. Chip design features have increased allowed tolerances during fabrication of the support structure giving a route to higher yield in manufacture.

Text
ESTC2020_Abstract52_Mitchell_Flip-Chip - Accepted Manuscript
Available under License University of Southampton Accepted Manuscript Licence.
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More information

Published date: 18 September 2020
Venue - Dates: Electronics System-Integration Technology Conference 2020, Tønsberg Pier, Vestfold, Norway, 2020-09-15 - 2020-09-18
Related URLs:
Learn more about Zepler Institute for Photonics and Nanoelectronics research Learn more about Zepler Institute for Photonics and Nanoelectronics research Learn more about Institute for Life Sciences research

Identifiers

Local EPrints ID: 443958
URI: http://eprints.soton.ac.uk/id/eprint/443958
DOI: doi:10.1109/estc48849.2020.9229661
PURE UUID: 2cf39067-2556-4a84-8757-756be2aa7e4f
ORCID for Colin Mitchell: ORCID iD orcid.org/0000-0001-9773-8842
ORCID for Xia Chen: ORCID iD orcid.org/0000-0002-0994-5401
ORCID for Stevan Stanković: ORCID iD orcid.org/0000-0001-6154-3138
ORCID for James S Wilkinson: ORCID iD orcid.org/0000-0003-4712-1697

Catalogue record

Date deposited: 18 Sep 2020 16:30
Last modified: 18 Mar 2024 03:25

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Contributors

Author: Colin Mitchell ORCID iD
Author: Ralph Schachler
Author: Ke Li
Author: Ali Z Khokhar
Author: Xia Chen ORCID iD
Author: Stevan Stanković ORCID iD
Author: Neil Sessions
Author: Katarzyna Grabska
Author: Xiangjun Wang
Author: David Thomson
Author: Christoph Daedlow
Author: Graham Reed
Author: James S Wilkinson ORCID iD

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