Tooling and procedures for hybrid integration of lasers by flip-chip technology
Tooling and procedures for hybrid integration of lasers by flip-chip technology
A method of achieving hybrid integration of laser bars on a silicon platform, using chip-flip bonding, is presented. A support structure etched into the substrate is used to provide vertical alignment to the plane utilizing a gimballed placement laser tool. In-plane accuracy is provided by bonder tolerances, with facet-to-facet alignment enabled by high magnification optics and the dimensions of the laser bar. Chip design features have increased allowed tolerances during fabrication of the support structure giving a route to higher yield in manufacture.
Mitchell, Colin
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Schachler, Ralph
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Li, Ke
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Khokhar, Ali Z
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Chen, Xia
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Stanković, Stevan
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Sessions, Neil
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Grabska, Katarzyna
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Wang, Xiangjun
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Thomson, David
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Daedlow, Christoph
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Reed, Graham
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Wilkinson, James S
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18 September 2020
Mitchell, Colin
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Schachler, Ralph
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Li, Ke
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Khokhar, Ali Z
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Chen, Xia
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Stanković, Stevan
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Sessions, Neil
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Grabska, Katarzyna
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Wang, Xiangjun
07a972f2-d0cd-4138-a11c-181bbc4a343e
Thomson, David
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Daedlow, Christoph
23b4a3ca-a0ad-4430-a116-40c06cd20fbe
Reed, Graham
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Wilkinson, James S
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Mitchell, Colin, Schachler, Ralph, Li, Ke, Khokhar, Ali Z, Chen, Xia, Stanković, Stevan, Sessions, Neil, Grabska, Katarzyna, Wang, Xiangjun, Thomson, David, Daedlow, Christoph, Reed, Graham and Wilkinson, James S
(2020)
Tooling and procedures for hybrid integration of lasers by flip-chip technology.
In Proceedings of the 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
IEEE.
7 pp
.
(doi:10.1109/estc48849.2020.9229661).
Record type:
Conference or Workshop Item
(Paper)
Abstract
A method of achieving hybrid integration of laser bars on a silicon platform, using chip-flip bonding, is presented. A support structure etched into the substrate is used to provide vertical alignment to the plane utilizing a gimballed placement laser tool. In-plane accuracy is provided by bonder tolerances, with facet-to-facet alignment enabled by high magnification optics and the dimensions of the laser bar. Chip design features have increased allowed tolerances during fabrication of the support structure giving a route to higher yield in manufacture.
Text
ESTC2020_Abstract52_Mitchell_Flip-Chip
- Accepted Manuscript
More information
Published date: 18 September 2020
Venue - Dates:
Electronics System-Integration Technology Conference 2020, Tønsberg Pier, Vestfold, Norway, 2020-09-15 - 2020-09-18
Identifiers
Local EPrints ID: 443958
URI: http://eprints.soton.ac.uk/id/eprint/443958
PURE UUID: 2cf39067-2556-4a84-8757-756be2aa7e4f
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Date deposited: 18 Sep 2020 16:30
Last modified: 18 Mar 2024 03:25
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Contributors
Author:
Ralph Schachler
Author:
Ali Z Khokhar
Author:
Xia Chen
Author:
Stevan Stanković
Author:
Neil Sessions
Author:
Katarzyna Grabska
Author:
Christoph Daedlow
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