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Tooling and procedures for hybrid integration of lasers by flip-chip technology

Tooling and procedures for hybrid integration of lasers by flip-chip technology
Tooling and procedures for hybrid integration of lasers by flip-chip technology
A method of achieving hybrid integration of laser bars on a silicon platform, using chip-flip bonding, is presented. A support structure etched into the substrate is used to provide vertical alignment to the plane utilizing a gimballed placement laser tool. In-plane accuracy is provided by bonder tolerances, with facet-to-facet alignment enabled by high magnification optics and the dimensions of the laser bar. Chip design features have increased allowed tolerances during fabrication of the support structure giving a route to higher yield in manufacture.
Mitchell, Colin
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Schachler, Ralph
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Li, Ke
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Khokhar, Ali Z
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Chen, Xia
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Stanković, Stevan
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Sessions, Neil
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Grabska, Katarzyna
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Wang, Xiangjun
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Thomson, David
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Daedlow, Christoph
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Reed, Graham
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Wilkinson, James S
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Mitchell, Colin
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Schachler, Ralph
8c2a398e-0fed-44bf-be28-a7b52c7a63e1
Li, Ke
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Khokhar, Ali Z
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Chen, Xia
64f6ab92-ca11-4489-8c03-52bc986209ae
Stanković, Stevan
13e8c464-b876-405a-b442-7c437a6eafd3
Sessions, Neil
ee737092-56b4-403e-a2f9-764e07e42625
Grabska, Katarzyna
b8a061e3-7774-4b33-be83-74e1a0aec31a
Wang, Xiangjun
07a972f2-d0cd-4138-a11c-181bbc4a343e
Thomson, David
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Daedlow, Christoph
23b4a3ca-a0ad-4430-a116-40c06cd20fbe
Reed, Graham
ca08dd60-c072-4d7d-b254-75714d570139
Wilkinson, James S
73483cf3-d9f2-4688-9b09-1c84257884ca

Mitchell, Colin, Schachler, Ralph, Li, Ke, Khokhar, Ali Z, Chen, Xia, Stanković, Stevan, Sessions, Neil, Grabska, Katarzyna, Wang, Xiangjun, Thomson, David, Daedlow, Christoph, Reed, Graham and Wilkinson, James S (2020) Tooling and procedures for hybrid integration of lasers by flip-chip technology. Electronics System-Integration Technology Conference 2020, Tønsberg Pier, Vestfold, Norway. 15 - 18 Sep 2020. 7 pp . (In Press)

Record type: Conference or Workshop Item (Paper)

Abstract

A method of achieving hybrid integration of laser bars on a silicon platform, using chip-flip bonding, is presented. A support structure etched into the substrate is used to provide vertical alignment to the plane utilizing a gimballed placement laser tool. In-plane accuracy is provided by bonder tolerances, with facet-to-facet alignment enabled by high magnification optics and the dimensions of the laser bar. Chip design features have increased allowed tolerances during fabrication of the support structure giving a route to higher yield in manufacture.

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ESTC2020_Abstract52_Mitchell_Flip-Chip - Accepted Manuscript
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More information

Accepted/In Press date: 2020
Venue - Dates: Electronics System-Integration Technology Conference 2020, Tønsberg Pier, Vestfold, Norway, 2020-09-15 - 2020-09-18

Identifiers

Local EPrints ID: 443958
URI: http://eprints.soton.ac.uk/id/eprint/443958
PURE UUID: 2cf39067-2556-4a84-8757-756be2aa7e4f
ORCID for Colin Mitchell: ORCID iD orcid.org/0000-0001-9773-8842
ORCID for Xia Chen: ORCID iD orcid.org/0000-0002-0994-5401
ORCID for Stevan Stanković: ORCID iD orcid.org/0000-0001-6154-3138
ORCID for James S Wilkinson: ORCID iD orcid.org/0000-0003-4712-1697

Catalogue record

Date deposited: 18 Sep 2020 16:30
Last modified: 18 Feb 2021 17:21

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Contributors

Author: Colin Mitchell ORCID iD
Author: Ralph Schachler
Author: Ke Li
Author: Ali Z Khokhar
Author: Xia Chen ORCID iD
Author: Stevan Stanković ORCID iD
Author: Neil Sessions
Author: Katarzyna Grabska
Author: Xiangjun Wang
Author: David Thomson
Author: Christoph Daedlow
Author: Graham Reed

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