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Bootstrapped driver and the single-event-upset effect

Bootstrapped driver and the single-event-upset effect
Bootstrapped driver and the single-event-upset effect
As VLSI circuits are progressing in very Deep Submicron (DSM) regime without decreasing chip area, the importance of global interconnects increases but at the cost of performance and power consumption. This work proposes a low power circuit for driving a global interconnect at voltages close to the noise level. In order to address ultra-low power (ULP) design limitations, a novel driver scheme has been configured. This scheme uses a bootstrap circuitry which boosts the driver's ability to drive a long interconnect with an important feedback feature in it. Hence, this approach achieves two objectives: improving performance and mitigating power consumed. Those achievements are essential in designing ULP circuits along with occupying a smaller footprint and being immune to noise, observed in this design as well. These have been verified by comparing the proposed design to the previous and traditional circuits using a simulation tool. Additionally, the boosting based approach has been shown beneficial in mitigating the effects of single-event upsets (SEU), which are known to affect DSM circuits working under low voltages. As a result, the proposed circuit demonstrates a promising solution to address the energy and performance issues related to scaling effects on interconnects along with soft errors that can be caused by neutron particles.
Ultra-low power (ULP), boosting, charge pump, driver, interconnect, single event upset (SEU)
1549-8328
3309-3319
Al-Daloo, Mohammed
1625bed5-b853-414e-a083-d12825442296
Abufalgha, Mohamed A.
e7780a58-265e-4c29-8d1d-7d9bc8a8d462
Yakovlev, Alex
d6c94911-c126-4cb7-8f92-d71a898ebbb2
Halak, Basel
8221f839-0dfd-4f81-9865-37def5f79f33
Al-Daloo, Mohammed
1625bed5-b853-414e-a083-d12825442296
Abufalgha, Mohamed A.
e7780a58-265e-4c29-8d1d-7d9bc8a8d462
Yakovlev, Alex
d6c94911-c126-4cb7-8f92-d71a898ebbb2
Halak, Basel
8221f839-0dfd-4f81-9865-37def5f79f33

Al-Daloo, Mohammed, Abufalgha, Mohamed A., Yakovlev, Alex and Halak, Basel (2020) Bootstrapped driver and the single-event-upset effect. IEEE Transactions on Circuits and Systems I: Regular Papers, 67 (10), 3309-3319, [9145625]. (doi:10.1109/TCSI.2020.3008112).

Record type: Article

Abstract

As VLSI circuits are progressing in very Deep Submicron (DSM) regime without decreasing chip area, the importance of global interconnects increases but at the cost of performance and power consumption. This work proposes a low power circuit for driving a global interconnect at voltages close to the noise level. In order to address ultra-low power (ULP) design limitations, a novel driver scheme has been configured. This scheme uses a bootstrap circuitry which boosts the driver's ability to drive a long interconnect with an important feedback feature in it. Hence, this approach achieves two objectives: improving performance and mitigating power consumed. Those achievements are essential in designing ULP circuits along with occupying a smaller footprint and being immune to noise, observed in this design as well. These have been verified by comparing the proposed design to the previous and traditional circuits using a simulation tool. Additionally, the boosting based approach has been shown beneficial in mitigating the effects of single-event upsets (SEU), which are known to affect DSM circuits working under low voltages. As a result, the proposed circuit demonstrates a promising solution to address the energy and performance issues related to scaling effects on interconnects along with soft errors that can be caused by neutron particles.

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Bootstrapped Driver and the Single-Event-Upset Effect - Accepted Manuscript
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More information

Accepted/In Press date: 29 June 2020
e-pub ahead of print date: 27 July 2020
Published date: October 2020
Keywords: Ultra-low power (ULP), boosting, charge pump, driver, interconnect, single event upset (SEU)

Identifiers

Local EPrints ID: 444634
URI: http://eprints.soton.ac.uk/id/eprint/444634
ISSN: 1549-8328
PURE UUID: 56e1fe82-054c-40cf-a390-20e19d7f5680
ORCID for Basel Halak: ORCID iD orcid.org/0000-0003-3470-7226

Catalogue record

Date deposited: 28 Oct 2020 17:30
Last modified: 10 Jan 2022 02:58

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Contributors

Author: Mohammed Al-Daloo
Author: Mohamed A. Abufalgha
Author: Alex Yakovlev
Author: Basel Halak ORCID iD

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