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High-temperature polyimide dielectric materials for energy storage

High-temperature polyimide dielectric materials for energy storage
High-temperature polyimide dielectric materials for energy storage
The availability of high-temperature dielectrics is key to develop advanced electronics and power systems that operate under extreme environmental conditions. In the past few years, many improvements have been made and many exciting developments have taken place. However, currently available candidate materials and methods still do not meet the applicable standards. Polyimide (PI) was found to be the preferred choice for high-temperature dielectric films development due to its thermal stability, dielectric properties, and flexibility. However, it has disadvantages such as a relatively low dielectric permittivity. This chapter presents an overview of recent progress on PI dielectric materials for high-temperature capacitive energy storage applications. In this way, a new molecular design of the skeleton structure of PI should be performed to balance size and thermal stability and to optimize energy storage property for high-temperature application. The improved performance can be generated via incorporation of inorganic units into polymers to form organic-inorganic hybrid and composite structures
polyimide, thermal property, dielectric property, energy storage, nanocomposites
IN TECH
Chen, George
3de45a9c-6c9a-4bcb-90c3-d7e26be21819
Zha, Junwei
a0f07d48-ce93-4aa0-a281-7aee7a560c28
Liu, Xue-Jie
46a3ea02-fa2b-464b-891d-83003daabc08
Tian, Yaya
99766dc4-683f-47c4-97b8-6637b82d4f8d
Dang, Zhimin
f56195f6-1da0-457c-9257-9f18f3773588
Chen, George
3de45a9c-6c9a-4bcb-90c3-d7e26be21819
Zha, Junwei
a0f07d48-ce93-4aa0-a281-7aee7a560c28
Liu, Xue-Jie
46a3ea02-fa2b-464b-891d-83003daabc08
Tian, Yaya
99766dc4-683f-47c4-97b8-6637b82d4f8d
Dang, Zhimin
f56195f6-1da0-457c-9257-9f18f3773588

Chen, George, Zha, Junwei, Liu, Xue-Jie, Tian, Yaya and Dang, Zhimin (2020) High-temperature polyimide dielectric materials for energy storage. In, Polyimide for Electronic and Electrical Engineering Applications. IN TECH. (doi:10.5772/intechopen.92260).

Record type: Book Section

Abstract

The availability of high-temperature dielectrics is key to develop advanced electronics and power systems that operate under extreme environmental conditions. In the past few years, many improvements have been made and many exciting developments have taken place. However, currently available candidate materials and methods still do not meet the applicable standards. Polyimide (PI) was found to be the preferred choice for high-temperature dielectric films development due to its thermal stability, dielectric properties, and flexibility. However, it has disadvantages such as a relatively low dielectric permittivity. This chapter presents an overview of recent progress on PI dielectric materials for high-temperature capacitive energy storage applications. In this way, a new molecular design of the skeleton structure of PI should be performed to balance size and thermal stability and to optimize energy storage property for high-temperature application. The improved performance can be generated via incorporation of inorganic units into polymers to form organic-inorganic hybrid and composite structures

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More information

Published date: 26 May 2020
Keywords: polyimide, thermal property, dielectric property, energy storage, nanocomposites

Identifiers

Local EPrints ID: 445726
URI: http://eprints.soton.ac.uk/id/eprint/445726
PURE UUID: 26730439-f2fe-4ea1-8bc1-b3fe8f4dca04

Catalogue record

Date deposited: 06 Jan 2021 17:43
Last modified: 06 Jan 2021 17:43

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Contributors

Author: George Chen
Author: Junwei Zha
Author: Xue-Jie Liu
Author: Yaya Tian
Author: Zhimin Dang

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